Semiconductor Shield Spacer for Compact RF EMI Protection
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Solution Overview
Problem
Existing semiconductor packages require additional space for compartmental RF shielding, increasing the footprint and profile, which is inefficient for compact designs.
Innovation Solution
A semiconductor device with a substrate, a die electrically attached to the substrate, and a shield spacer with wirebonds and a mold compound for encapsulation, which provides compartmental RF shielding while minimizing the package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If compartmental RF shielding is implemented using traditional methods (embedded shields, metal cans, wire fences, laser ablated vias), then EMI radiation is minimized and RF interference is prevented, but the footprint and profile of the semiconductor package increase
Solution Approach 1:
The shield spacer is positioned within the semiconductor package structure, nesting the shielding function inside the existing package footprint rather than adding external shielding components. This allows the shielding to be contained within the same boundary as the die and substrate, reducing the overall package area.
Solution Approach 2:
The shield spacer extends vertically from the substrate toward the die, utilizing the vertical dimension (z-axis) to provide shielding coverage. By implementing shielding in the vertical direction rather than requiring additional horizontal space, the package footprint is reduced while maintaining effective EMI protection.
2Object-affected harmful factors
If compartmental RF shielding is implemented using traditional methods (embedded shields, metal cans, wire fences, laser ablated vias), then EMI radiation is minimized and RF interference is prevented, but the profile of the semiconductor package increases
Solution Approach 1:
The shield spacer is implemented as a thin film or shell structure that provides RF shielding with minimal thickness. This thin-film approach allows effective EMI protection while maintaining a low package profile, avoiding the need for bulky metal cans or thick embedded shields.
Solution Approach 2:
The shield spacer is nested within the package structure between the substrate and die, utilizing the existing vertical space rather than extending the overall package height. This nesting approach provides shielding coverage without increasing the package profile.
3Area of stationary object
If shield spacer with wirebonds is used for compartmental RF shielding, then footprint and profile are reduced, but manufacturing complexity increases
Solution Approach 1:
The wirebonds serve dual functions: providing electrical connectivity between the die and substrate, and forming part of the RF shielding structure by connecting to the shield spacer. This multi-functionality eliminates the need for separate shielding components, simplifying the manufacturing process despite the integrated design.
Solution Approach 2:
The shielding function is merged with the existing wirebond interconnect structure. The wirebonds are integrated into the shielding architecture, combining two previously separate functions (electrical connection and EMI protection) into a unified manufacturing process.
Data Source
AI summary
A semiconductor device has a substrate. A first die is electrically attached to a first surface of the substrate. A shield spacer having a first and second surface is provided wherein the second surface of the shield spacer is attached to a first surface of the first die. A plurality of wirebonds are attached to the shield spacer and to the substrate. A mold compound is provided for encapsulating the first die, the shield spacer, and the wirebonds.