Shield-Spacer Integrated Circuit Packaging for Thermal and EMI Management
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Solution Overview
Problem
Current integrated circuit packaging technologies face challenges in achieving smaller footprints, reducing electromagnetic interference, thermal loads, and improving assembly reliability while maintaining low costs, as they struggle to meet the demands of high-volume production of portable electronic devices with increasing complexity and functionality.
Innovation Solution
The proposed integrated circuit packaging system incorporates a substrate with a bottom integrated circuit mounted on it, connected via interconnects, and features a shield-spacer structure that includes a shield plate, pillars, and protuberances to enhance thermal management, reduce noise, and improve wire bonding capabilities, while maintaining a compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional packaging structures are used, then assembly is simpler, but package height is larger and thermal management is poorer
Solution Approach 1:
The spacer structure serves multiple functions simultaneously: it provides mechanical support, establishes precise spacing between components, provides thermal management pathways, and enables effective grounding. This multi-functionality resolves the contradiction by integrating what would otherwise be separate components into a single unified structure.
Solution Approach 2:
The packaging structure is divided into distinct functional zones: the spacer region for mechanical support and spacing, the grounding plate region for electrical reference, and the heat dissipation pathways. This segmentation allows each region to be optimized for its specific function while working together as a unified system.
2Object-affected harmful factors
If shielding structures are added to reduce electromagnetic interference, then noise reduction is improved, but device complexity increases
Solution Approach 1:
The grounding plate integrated into the spacer structure serves dual purposes: it provides the electrical reference potential needed for EMI shielding while simultaneously serving as a mechanical support element and thermal management pathway. This eliminates the need for separate shielding structures.
Solution Approach 2:
The shielding function is merged with the existing spacer and grounding infrastructure rather than being added as a separate component. The conductive grounding plate becomes part of the spacer assembly, providing EMI protection without requiring additional discrete shielding elements.
3Area of stationary object
If compact packaging is implemented to reduce footprint, then area is reduced, but thermal management and signal integrity become more difficult
Solution Approach 1:
The design transitions from two-dimensional planar layouts to three-dimensional vertical stacking with the spacer structure. Heat dissipation pathways are established in the vertical dimension through the spacer height, allowing thermal management without increasing the horizontal footprint.
Solution Approach 2:
The spacer structure provides simultaneous mechanical support, precise spacing, and thermal management functions within the compact volume. The integrated grounding plate further adds electrical reference functionality, maximizing the utility of the compact packaging structure.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a bottom integrated circuit over the substrate; connecting a bottom interconnect between the bottom integrated circuit and the substrate; and mounting a bottom shield-spacer above the bottom integrated circuit and the bottom shield-spacer includes a bottom shield plate above the bottom integrated circuit, a bottom shield pillar extending from a bottom shield foot and connected to the bottom shield plate, and a protuberance extending vertically above the bottom shield pillar and directly above the bottom shield foot.