Shield Spring Portions Stabilize Metallic Component Contact
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Solution Overview
Problem
Existing electronic apparatuses face challenges in achieving stable electrical contact between metallic components and shields, leading to insufficient suppression of electromagnetic radiation due to unstable positioning and contact.
Innovation Solution
The electronic apparatus incorporates a plate-like shield with spring portions and position determining portions to securely position and maintain contact with metallic components, ensuring stable electrical grounding and effective radiation suppression.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If protrusions on metallic components are fitted into through holes on the shield, then the position of metallic component is determined, but contact stability between metallic component and shield is insufficient
Solution Approach 1:
The patent applies the dynamics principle by replacing rigid fit connections with elastic spring portions that can dynamically adjust to manufacturing tolerances and thermal expansion. The spring portions maintain continuous elastic contact between the metallic component and shield, ensuring stable electrical connection while allowing for positional variations. This elastic dynamic contact resolves the contradiction between precise position determination and reliable contact stability.
2Object-affected harmful factors
If metallic component is positioned near IC chip, then electromagnetic radiation suppression is improved, but the metallic component acts as antenna and emits electromagnetic waves
Solution Approach 1:
The patent applies the intermediary principle by introducing the shield as a mediating structure between the metallic component and the external environment. The shield, positioned between the metallic component and surrounding space, blocks electromagnetic waves generated by the metallic component from radiating outward. This intermediary shield structure enables the metallic component to be positioned near the IC chip for radiation suppression while preventing it from acting as an effective antenna, thus resolving the contradiction between suppression and emission.
3Reliability
If spring portions are added to push metallic component toward other edge, then contact stability is improved, but device complexity increases
Solution Approach 1:
The patent applies the merging principle by integrating the spring portions directly into the shield structure itself, rather than adding separate external components. The spring portions are formed as integral parts of the shield, combining the shielding function with the contact stabilization function in a single unified structure. This merging approach improves contact stability while minimizing the increase in device complexity, as no additional separate components are required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration stabilizes the position of metallic components, enhancing electrical contact and effectively reducing electromagnetic radiation emissions.
Implementation Method 1
spring portions that are in contact with the metallic component to push the metallic component toward the other edge
Implementation Method 2
a plate-like shield that covers the circuit board... to suppress unnecessary electromagnetic radiation
Data Source
AI summary
The inner edge of a hole 23 surrounding the outer circumference of a first heat sink 61 includes two edges 23a and 23b that are positioned on opposite sides to each other with the first heat sink 61 therebetween. An upper frame (shield) 20 includes spring portions 24 on one edge 23a, which is in contact with the first heat sink 61 to push the first heat sink 61 toward the other edge 23b. Further, the upper frame 20 includes, the other edge 23b, a position determining portion 25 to which the first heat sink 61 is pressed. According to the above electronic apparatus, it is possible to define the position of a metallic component by a shield covering a circuit board and to cause the metallic component and the shield to be in contact stably.