Shielded Antenna Package With Non-Shielding Channel for EMI Control
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Solution Overview
Problem
Existing communication products face issues with high-frequency signal interference, which can lead to signal degradation and affect normal operation, particularly in wireless communication devices where patch antennas are commonly used.
Innovation Solution
The antenna device incorporates multiple substrate layers, metallic layers, non-shielding channels, electronic components, shielding layers, and antenna units, with magnetic structures to reduce interference by allowing high-frequency signals to pass through without interference and minimize signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If shielding structures are added to block high-frequency signals, then interference protection is improved, but device complexity increases
Solution Approach 1:
The shielding layer is integrated within the electronic component package, nesting the shielding function inside the existing component structure. This allows the shielding layer to protect the electronic component from high-frequency interference without adding external structures, thus improving interference protection while minimizing increases in device complexity.
Solution Approach 2:
The electronic component package serves multiple functions: it houses the electronic component, provides structural support, and incorporates the shielding layer for electromagnetic interference protection. By making the package multi-functional, the design achieves interference shielding without requiring separate dedicated shielding structures, thereby reducing overall device complexity.
2Object-affected harmful factors
If metallic layers are added to shield signals, then interference protection is improved, but signal transmission performance deteriorates
Solution Approach 1:
The shielding layer is selectively positioned only where needed - specifically within the electronic component package and at strategic locations in the antenna device. This localized shielding approach provides interference protection at critical points while leaving signal transmission paths largely unaffected, thus improving interference protection without significantly degrading signal transmission performance.
Solution Approach 2:
The shielding layer acts as an intermediary element that selectively interacts with electromagnetic fields. It blocks harmful high-frequency signals from reaching the electronic component while allowing necessary signal frequencies to pass through unaffected paths, thus mediating between interference protection and signal transmission requirements.
3Ease of manufacture
If the antenna device structure is simplified, then ease of manufacture is improved, but interference shielding capability deteriorates
Solution Approach 1:
The shielding function is merged with the electronic component package structure rather than being a separate component. This integration allows the shielding layer to be manufactured together with the package in the same production process, improving ease of manufacture while maintaining effective interference shielding capability through the combined structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively shields external high-frequency signals, preventing interference with the antenna's normal operation and neighboring components, while reducing unnecessary signal modes and loss.
Implementation Method 1
The shielding layer electrically shields the electronic component and is electrically connected to the first metallic layer
Implementation Method 2
the antenna device further includes a thermally-conductive insulator having a cavity being hollow, the thermally-conductive insulator fully covers the electronic component by the cavity
Implementation Method 3
the first magnetic structure has a transmittance of less than or equal to 50% for at least one antenna working signal
Data Source
AI summary
An antenna device includes substrate layers, metallic layers, a non-shielding channel, an electronic component, a shielding layer and an antenna unit. The substrate layers include an upper substrate layer and a lower substrate layer located on two sides respectively. The metallic layers are disposed on the substrate layers. The non-shielding channel is at least defined at the upper substrate layer and communicates with the inner and outer surfaces of the upper substrate layer without being interfered by the first metallic layer. The electronic component is disposed on the outer surface of the upper substrate layer and corresponds to and at least partially covers the non-shielding channel. The shielding layer electrically shields the electronic component and is electrically connected to the first metallic layer. The antenna unit is disposed on an outer surface of the lower substrate layer and electrically coupled to the electronic component.