Shielded Circuit Board Assembly With Sealing Bag Heat Dissipation
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Solution Overview
Problem
The reliability of heat dissipation in electronic devices is compromised due to thermally conductive adhesive falling off during high-temperature soldering, leading to poor heat dissipation and prolonged repair times.
Innovation Solution
A circuit board assembly with a flexible sealing bag containing a filler material, which accommodates the electronic element and ensures a large heat exchange area, preventing adhesive loss and facilitating easy repair by allowing the filler to be stuffed after soldering, while also supporting the element and reducing electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermally conductive adhesive is applied to electronic elements for heat dissipation, then heat dissipation function is achieved, but the adhesive falls off during high-temperature soldering, reducing reliability
Solution Approach 1:
A sealing bag filled with thermally conductive filler material serves as an intermediary between the electronic element and the heat dissipation structure. The sealing bag is fastened to the electronic element using soldering, while the filler material inside provides thermal conduction. This mediator approach allows the adhesive to be applied to the sealing bag rather than directly to the electronic element, preventing adhesive failure during soldering while maintaining heat dissipation functionality.
Solution Approach 2:
The heat dissipation system is segmented into three distinct components: the electronic element, the sealing bag containing filler material, and the heat dissipation structure. This segmentation allows each component to perform its specific function independently - the sealing bag provides both mechanical attachment and thermal conduction, while the filler material provides the thermal pathway, resolving the conflict between bonding strength and heat dissipation reliability.
2Ease of repair
If traditional adhesive-based heat dissipation is used, then simple structure is maintained, but repair time increases due to adhesive degradation and component damage
Solution Approach 1:
The sealing bag is designed as a separable component that can be removed from the electronic element without damaging surrounding components. This segmentation enables quick replacement of the heat dissipation assembly during repair, significantly reducing repair time compared to traditional adhesive-based methods that require careful removal and cleaning procedures.
Solution Approach 2:
The sealing bag with filler material functions as a replaceable, cost-effective component. When the heat dissipation performance degrades or the sealing bag becomes damaged, the entire assembly can be quickly replaced rather than attempting to repair the adhesive bond, reducing overall maintenance costs and repair time while extending device lifespan.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency, ensures reliability by preventing adhesive loss, reduces repair time, and minimizes electromagnetic interference, while supporting the electronic element and allowing for miniaturization of the device.
Implementation Method 1
the sealing bag can accommodate a filler material, so that a thermally conductive part that includes the sealing bag and the filler material can press against an entire outer surface that is of the first electronic element
Data Source
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AI summary
This application provides a circuit board assembly, an electronic device, and a method for producing a circuit board assembly, and relates to the field of electronic device technologies, to resolve a problem of how to improve reliability of heat dissipation performed for an electronic element. The circuit board assembly includes a first circuit board, a first shield body, a first electronic element, and a sealing bag. The first circuit board has a first surface. The first shield body is fastened on the first surface, and encloses a first accommodating cavity with the first surface. The first electronic element is disposed on the first surface and located in the first accommodating cavity. The sealing bag is configured to accommodate a filler material, the sealing bag includes a sealing bag body and a feeding cylinder, with their internal space communicating with each other, the sealing bag body is disposed in the first accommodating cavity, and the sealing bag body is flexible. The first shield body or the first circuit board has a first opening, and an end that is of the feeding cylinder and that is away from the sealing bag body is exposed to the outside of the first accommodating cavity by the first opening. The circuit board assembly provided in this application can improve reliability of heat dissipation performed for an electronic element.