Shielded Connector Cable Layout for Stable Impedance Matching
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Solution Overview
Problem
Existing connector cables that connect a connector and a shielded cable via a relay substrate face challenges in preventing increases in impedance and short circuits, particularly when the braided shield of the coaxial cable is removed.
Innovation Solution
The connector cable incorporates a GND conductor layer on the front surface of the relay substrate, covered with an insulating member, directly under the part where the shield member is removed, which effectively prevents impedance increases and short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the braided shield is removed to expose the core wire and intermediate insulator, then the connector cable can be assembled, but impedance increases and short circuit risk arises
Solution Approach 1:
The patent introduces a ground conductor layer on the relay substrate as an intermediary element between the exposed core wire and the surrounding environment. This ground layer, positioned directly under the exposed core wire where the shield member is removed, provides a reference potential that stabilizes impedance and prevents short circuits. The insulating member covering the ground conductor layer further mediates by providing electrical isolation while maintaining the ground reference, thus resolving the contradiction between assembly feasibility and electrical stability.
Solution Approach 2:
The patent addresses the impedance and short circuit issues by moving the grounding solution to another dimension - specifically, placing the ground conductor layer on the relay substrate plane rather than trying to extend ground patterns in the same plane as the exposed core wire. This vertical arrangement (ground layer on substrate beneath the exposed core wire) allows effective impedance control and short circuit prevention without the short circuit risk that would arise from planar extensions near the core wire.
2Reliability
If the ground pattern on the front surface side is extended to directly under the exposed part, then impedance increase can be reduced, but short circuit with the core wire may occur
Solution Approach 1:
The patent resolves this contradiction by positioning the ground conductor layer in a different spatial dimension - on the relay substrate plane directly under the exposed core wire, rather than extending the ground pattern in the same plane as the core wire. This vertical separation maintains the necessary ground reference for impedance control while the insulating member covering provides additional isolation, preventing short circuits that would occur with planar ground pattern extensions.
Solution Approach 2:
The patent segments the grounding function into separate components: the ground conductor layer on the relay substrate and the insulating member covering it. This segmentation allows the ground layer to provide impedance control while the insulating member provides short circuit prevention, thereby resolving the contradiction between impedance matching and short circuit risk that would arise from a single integrated ground pattern extension.
3Device complexity
If the inner conductor is directly connected to the connector contact, then assembly is simplified, but impedance control becomes more difficult
Solution Approach 1:
The patent introduces the ground conductor layer on the relay substrate as an intermediary element that facilitates impedance control in the direct connection structure. By positioning this ground layer directly under the exposed core wire, the patent provides a reference potential that enables proper impedance control even though the inner conductor is directly connected to the connector contact without complex routing. This intermediary ground layer resolves the contradiction between simplified assembly and effective impedance control.
Data Source
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AI summary
A connector cable comprising a connector, a shielded cable and a relay substrate, the connector and the shielded cable being connected via the relay substrate, wherein the shielded cable includes at least an inner conductor, a dielectric covering the inner conductor, and a shield member covering the dielectric, the inner conductor is connected to a contact of the connector at a part where the shield member and the dielectric are removed to expose the inner conductor, at least directly under a part where the shield member is removed to expose the dielectric, a ground conductor layer on a front surface of the relay substrate is arranged, and the ground conductor layer on the front surface of the relay substrate, which is arranged directly under the part where the shield member is removed, is covered with an insulating member, wherein the connection part between the contact of the connector and the exposed inner conductor of the shielded cable is connected by soldering, and the relay substrate is cut out at a part directly under the contact of the connector and the exposed inner conductor of the shielded cable for forming a cut-out region where the relay substrate including the ground conductor layer is absent.