Shielded Cable Laser Cutting for Precise Shield Wire Removal
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for cutting shield wires in shielded cables are inefficient and prone to high reject rates due to the use of worn rotating knives, and require additional steps like applying a support crimp, which increases assembly time and cost.
Innovation Solution
A laser cutting device that uses a laser beam to cut shield wires without the need for a support crimp, employing a clamping mechanism to position the wires radially and a control system to guide the laser beam in a circular path around the central axis, ensuring precise cutting and reduced wear.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If rotating blades are used to remove shield wires and shielding foils, then the cables can be processed, but the blades are subject to very high wear and the scrap rate increases significantly
Solution Approach 1:
The patent replaces the mechanical rotating blade system with a laser-based cutting system. The laser beam cuts the shield wires and shielding foils without physical contact, eliminating blade wear and the associated high scrap rate. The laser method provides consistent cutting quality without the degradation that occurs with worn blades.
Solution Approach 2:
The invention changes the cutting parameter from mechanical force (rotating blades) to optical energy (laser beam). This fundamental parameter change allows for precise control of the cutting process and eliminates the wear mechanism inherent in mechanical blade systems, thereby reducing scrap rate while maintaining manufacturing capability.
2Object-affected harmful factors
If a support crimp is applied to prevent laser damage to the cable jacket, then the cable jacket is protected, but the assembly time increases and the process becomes more expensive
Solution Approach 1:
The patent removes the support crimp step from the assembly process. By carefully controlling the laser parameters and cutting path, the method directly cuts the shield wires without requiring the additional support crimp component that was previously needed to protect the cable jacket. This extraction of the unnecessary step reduces assembly time and cost.
Solution Approach 2:
The laser cutting process is designed to be self-regulating, where the laser parameters and cable positioning work together to naturally prevent damage to the cable jacket without requiring external protective measures like support crimps. The system serves itself by using controlled optical energy distribution to achieve both cutting and protection functions simultaneously.
3Ease of operation
If manual removal of shield wires is performed, then flexibility is maintained, but the quality and throughput are highly dependent on the operator
Solution Approach 1:
The patent replaces manual mechanical removal with an automated laser cutting system. This substitution maintains operational flexibility through programmable control while dramatically increasing throughput by eliminating human speed limitations and variability. The automated system can consistently process cables at high speed without the operator dependency that plagues manual methods.
4Productivity
If automated removal with rotating blades is used, then throughput increases, but the scrap rate becomes significant due to blade wear
Solution Approach 1:
The patent replaces the mechanical rotating blade system with a laser cutting system, maintaining the high throughput of automated processing while eliminating the blade wear problem that causes significant scrap rates. The laser method provides consistent cutting quality throughout the production run without the degradation inherent in mechanical blade systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reproducible and quick cutting of shield wires, enhancing automation and reducing assembly time and costs by eliminating the need for a support crimp and minimizing wear on cutting tools.
Implementation Method 1
A laser cutting device (3) is used, in particular for laser cutting of shielding wires (1b). The laser beam (16) is focused via a first, second and third mirror (25a, 25b) towards the cable (1) to be cut. The laser beam (16) hits the cable (1) radially, cutting it along its peripheral wall.
Implementation Method 2
The laser device (15) is controlled such that the laser beam (16) hits the erected shielding wires (1b) on the end face region (5) of the clamping device (2).
Data Source
Figure 1A~1B
Figure 2A
Figure 2B
AI summary
The invention relates to a laser cutting device (3) comprising a laser unit (15) which generates a laser beam (16). A clamping device (2) is provided comprising a first and second clamping jaw (2a, 2b), wherein the shielded cable (1) can be positioned between these clamping jaws (2a, 2b). Both clamping jaws (2a, 2b) can be brought in contact in a closed state, whereby the shielded cable (1) can be clamped between said clamping jaws (2a, 2b). Both clamping jaws (2a, 2b) comprise a respective end face (5a, 5b), wherein an end face region (5) of the clamping device (2) is formed by these end faces (5a, 5b). The shielded cable (1) projects beyond the end face region (5) of the clamping device. Shield wires (1b) of the shielded cable (1) can be positioned radially or with radial components outwards from the shielded cable (1) and can be placed against the end face region (5) of the clamping device (2). The laser unit (15) emits the laser beam (16) onto the end face region (2a) of the clamping device (2), whereby the positioned shield wires (1b) can be cut.