Shielded Capacitor Structure With Insulating Layer for EMI Control
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Solution Overview
Problem
Conventional EMI-shielding techniques for electronic components in miniaturized devices increase volume and can reduce RF performance, and there is a need for effective EMI noise shielding that does not compromise component characteristics or lead to shorts during mounting.
Innovation Solution
An electronic component design featuring a capacitor body with a dielectric layer and internal electrodes, a shielding layer with a cap portion and side walls, and an insulating layer that reduces leakage flux and prevents shorts by exposing a lower portion of the capacitor body, allowing for efficient EMI shielding without increasing the component's volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shield can is used to surround electronic components and substrates, then EMI shielding is improved, but the component volume increases in Z, X and Y directions
Solution Approach 1:
The shielding layer is integrated within the capacitor structure itself, nesting the EMI shielding function inside the component rather than adding an external shield can. The shielding layer is formed between the dielectric layers and internal electrodes, making the capacitor body itself the shielded structure.
Solution Approach 2:
The EMI shielding function is merged with the capacitor structure by forming the shielding layer as part of the capacitor's internal architecture. The shielding layer is created simultaneously with the dielectric and electrode layers during the capacitor manufacturing process, combining multiple functions into a single integrated structure.
2Reliability
If an insulating layer is disposed between the capacitor body and shielding layer, then short prevention is improved, but the height of the component increases
Solution Approach 1:
The insulating layer is applied selectively only to specific regions where short prevention is needed, rather than covering the entire capacitor body. The lower portion of the capacitor body is exposed without insulating layer, maintaining electrical contact functionality while preventing shorts in critical areas.
Solution Approach 2:
Instead of applying insulating layer completely over the capacitor body, only partial coverage is provided where it is most needed for short prevention. This partial application reduces the overall height increase while still achieving the reliability goal of preventing solder-shielding layer shorts.
3Object-affected harmful factors
If the lower portion of the capacitor body is exposed from insulating layer and shielding layer, then EMI shielding effectiveness is improved, but manufacturing precision requirements increase
Solution Approach 1:
The insulating layer and shielding layer are formed with predetermined heights that automatically create the required exposed lower portion of the capacitor body. The heights of these layers are controlled during manufacturing to ensure the correct exposure amount, eliminating the need for subsequent precision machining or adjustment steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces leakage flux and prevents electrical shorts, maintaining component characteristics while enabling miniaturization and high RF performance in electronic devices.
Implementation Method 1
an insulating layer disposed between the capacitor body and the shielding layer
Data Source
AI summary
An electronic component includes a capacitor body including a dielectric layer and first and second internal electrodes, and a first to sixth surfaces, the first and the second internal electrodes being exposed through the third and the fourth surfaces, respectively; first and second external electrodes respectively extending from the third and fourth surfaces of the body to a portion of the first surface and respectively connected to the first and second internal electrodes; a shielding layer comprising a cap portion disposed on the second surface of the capacitor body and a side wall portion disposed on the third, fourth, fifth and sixth surfaces of the capacitor body; and an insulating layer disposed between the capacitor body and the shielding layer. A lower portion of the capacitor body is exposed from the insulating layer and the shielding layer.