Shielded Component Carrier Layout for RF Signal Integrity

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Solution Overview

Problem

Existing printed circuit boards face issues with unwanted coupling of radio frequency signals due to uncontrolled impedance, leading to instability in RF chips, particularly in high-frequency applications like 5G and 6G, which affect signal integrity and quality.

Innovation Solution

A carrier assembly is designed with a signal conductive element and a shielding conductive structure that is partially embedded in the component carrier, surrounding the signal conductive element to provide electromagnetic shielding and impedance control, using materials like copper and grounded connections to reduce interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If RF components are placed on printed circuit boards with uncontrolled impedance traces, then device complexity is reduced, but signal integrity deteriorates due to unwanted coupling and electromagnetic interference

Engineering Contradiction:

Improvesignal integrityVSAvoidcarrier assembly structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The shielding conductive structure is embedded within the component carrier, surrounding the signal conductive element in a nested configuration. This nesting approach provides electromagnetic shielding without adding external complexity, as the shielding structure is integrated inside the carrier itself rather than requiring separate external shields.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The shielding conductive structure acts as an intermediary element between the signal conductive element and the external environment. It mediates electromagnetic interference by providing a grounded shield that intercepts and redirects interfering fields, protecting the signal while maintaining controlled impedance.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If shielding structures are added around signal conductive elements, then electromagnetic interference is reduced, but manufacturing complexity increases

Engineering Contradiction:

Improveelectromagnetic interferenceVSAvoidcarrier assembly fabrication

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The shielding conductive structure and the component carrier are merged into a single integrated assembly. The shielding structure is embedded within the carrier during manufacturing, combining what could be separate components into one unified structure that is manufactured as a single unit, thereby reducing assembly steps.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The component carrier serves multiple functions: it provides mechanical support for the RF component, establishes controlled impedance traces, and incorporates embedded shielding structures for electromagnetic protection. This multi-functionality reduces the need for separate dedicated shielding components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If controlled impedance lines are implemented for RF chips, then signal quality improves, but unwanted coupling between input and output increases due to radiation

Engineering Contradiction:

Improvesignal qualityVSAvoidsignal radiation and coupling

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The shielding conductive structure is positioned to preemptively block electromagnetic radiation before it can cause unwanted coupling between the RF chip's input and output. The shield creates a protective barrier that intercepts radiating fields, preventing them from coupling to adjacent traces or components.

Inventive Principle:

Principle #9Preliminary anti-action

Solution Approach 2:

The shielding structure is nested around the signal conductive element and RF component, creating a contained electromagnetic environment. This nested configuration prevents radiation from escaping and coupling to external elements while maintaining the controlled impedance characteristics of the signal path.

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively shields RF components from electromagnetic interference, improving signal quality and allowing for closer placement of sensitive parts, enhancing signal integrity and flexibility in design for high-frequency applications.

Implementation Method 1

a shielding conductive structure, which is at least partially embedded in the component carrier and which at least partially surrounds or encircles said signal conductive element

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS20260040432A1Component carrier with signal conductive element and shielding conductive structure

Publication Date: 2026.02.05 AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AG

AI summary

A carrier assembly is provided. The carrier assembly includes: (i) a component carrier; (ii) a component in or on the component carrier, (iii) a signal conductive element provided on a component surface of the component; and (iv) a shielding conductive structure, which is at least partially embedded in the component carrier and which at least partially surrounds said signal conductive element.