Shielded Chip Package Structure for EMI Isolation and Grounding
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Solution Overview
Problem
The increasing electromagnetic interference (EMI) from high-frequency signals and antennas in modern electronic devices, such as those in 5G communication and automotive electronics, poses a challenge to the performance of chip package structures, as existing technologies lack effective magnetic shielding, leading to reduced operational efficiency and increased sensitivity to electromagnetic waves.
Innovation Solution
A chip package structure that includes a base board with a grounding pad, a chip assembly, a package body with obliquely disposed side walls, and a shielding layer electrically connected to the grounding pad, which covers the side walls of the package body and base board to isolate electromagnetic waves and provide shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional packaging structures are used without shielding layers, then manufacturing simplicity is maintained, but electromagnetic shielding capability is insufficient
Solution Approach 1:
The patent applies preliminary action by forming the shielding layer during the packaging process itself, rather than as a separate post-processing step. The shielding layer is deposited on the package body before final encapsulation, ensuring electromagnetic protection is built-in from the outset while maintaining manufacturing efficiency
Solution Approach 2:
The patent employs composite materials by combining the package body with an conductive shielding layer material. This creates a hybrid structure that maintains the protective function of the package body while adding electromagnetic shielding capability through the conductive layer, resolving the contradiction between simplicity and shielding performance
2Object-affected harmful factors
If shielding layers are added to provide electromagnetic protection, then shielding effectiveness is improved, but manufacturing process complexity increases
Solution Approach 1:
The patent merges the shielding layer formation with the existing packaging process by depositing the conductive layer on the package body during encapsulation. This integration eliminates separate shielding manufacturing steps, reducing overall process complexity while maintaining effective electromagnetic protection
Solution Approach 2:
The package body serves multiple functions: it provides mechanical protection and simultaneously acts as a substrate for the shielding layer. This multi-functionality reduces the need for additional components and simplifies the manufacturing process while achieving comprehensive electromagnetic shielding
3Object-affected harmful factors
If complex shielding structures are implemented, then electromagnetic shielding performance is enhanced, but production costs increase
Solution Approach 1:
The patent extracts the essential shielding function from complex multi-layer structures and implements it through a single conductive layer deposited on the package body. This extraction of the core shielding mechanism eliminates unnecessary complexity and material costs while maintaining effective electromagnetic protection
Solution Approach 2:
The patent uses a relatively thin conductive shielding layer that provides sufficient electromagnetic protection without requiring thick or multi-layer expensive materials. This cost-effective approach achieves the necessary shielding performance at minimal material and manufacturing cost
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively reduces electromagnetic interference by improving the uniformity and yield of the shielding layer, enhancing the electromagnetic shielding effect and mechanical protection of the chip package structure, while also simplifying the manufacturing process and reducing production costs.
Implementation Method 1
a shielding layer covering the side walls of the package body and the base board and electrically connected with the grounding pad
Data Source
AI summary
The present application provides chip package structures and manufacturing methods thereof. In one example, the chip package structure includes: a base board including a grounding pad; a chip assembly located at a first surface of the base board; a package body covering the chip assembly, wherein a side wall of the package body is located in an extension direction of a side wall of the base board, and the side wall of the package body and the first surface of the base board have an acute included angle therebetween; and a shielding layer covering the side walls of the package body and the base board and electrically connected with the grounding pad.