Shielded Circuit Board Assembly for Electromagnetic Isolation
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Solution Overview
Problem
Current chip packages experience electromagnetic interference due to electromagnetic waves generated by electronic components, leading to operational issues or malfunctions in devices like smartphones and tablets.
Innovation Solution
A circuit board assembly design featuring a core layer with accommodating spaces surrounded by first and second shielding ring walls, along with first and second circuit layers and insulating layers, which includes shielding columns to block electromagnetic waves, and a manufacturing method involving a composite dielectric layer and metal layers to form recesses and openings for effective shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components are placed in a chip package, then device functionality is improved, but electromagnetic interference between components increases
Solution Approach 1:
The chip package is segmented into multiple independent shielding cavities, each housing individual electronic components. The shielding cavities are separated by shielding walls that extend through the core layer, effectively dividing the package to prevent electromagnetic interference between components while maintaining device functionality.
Solution Approach 2:
Shielding walls and shielding cavities are introduced as intermediary structures between electronic components. These shielding structures act as mediators that block electromagnetic waves generated by components, preventing them from interfering with adjacent components while allowing the components to function.
2Object-affected harmful factors
If shielding structures are added to block electromagnetic waves, then electromagnetic interference is reduced, but device complexity increases
Solution Approach 1:
The shielding walls are merged with the core layer structure, forming an integrated substrate that combines structural support and electromagnetic shielding functions. The shielding cavities are formed by patterning the core layer itself, eliminating the need for separate shielding components and reducing overall device complexity.
Solution Approach 2:
The core layer serves multiple functions: it provides mechanical support as the substrate, creates shielding cavities through patterning, and forms shielding walls that block electromagnetic interference. This multi-functionality reduces the need for additional components and simplifies the overall device structure.
3Object-affected harmful factors
If shielding walls are formed around electronic components, then electromagnetic shielding is improved, but manufacturing precision requirements increase
Solution Approach 1:
The shielding cavities and walls are formed through preliminary patterning of the core layer before component placement. By pre-forming the shielding structures in the substrate, the precision requirements are reduced during subsequent component assembly, as the shielding geometry is already established.
Solution Approach 2:
The shielding effectiveness is optimized by adjusting parameters such as the thickness of shielding walls, the spacing between cavities, and the depth of cavity formation. These parameter optimizations allow effective electromagnetic shielding to be achieved with relaxed manufacturing tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively shields electromagnetic waves, preventing interference between electronic components and enhancing the rigidity of the circuit board assembly while ensuring the electronic components operate without interference.
Implementation Method 1
The first shielding ring wall is disposed in the accommodating space and covers the inner side wall, in which the first shielding ring wall surrounds the electronic component. The second shielding ring wall is disposed in the core layer and surrounds the first shielding ring wall. A plurality of first shielding columns are disposed in the first insulating layer.
Data Source
AI summary
The disclosure provides a circuit board assembly, which includes a core layer, an electronic component, a first shielding ring wall, a second shielding ring wall, a first circuit layer, a second circuit layer, a first insulating layer and first shielding columns. The core layer includes an accommodating space, and the accommodating space has an inner side wall. The first shielding ring wall is disposed in the accommodating space and covers the inner side wall, in which the first shielding ring wall surrounds the electronic component. The second shielding ring wall is disposed in the core layer and surrounds the first shielding ring wall. The core layer is disposed between the first circuit layer and the second circuit layer. The second circuit layer is disposed between the first insulating layer and the core layer. The first shielding columns are disposed in the first insulating layer.