Shielded Circuit Module Design for Size Reduction
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Solution Overview
Problem
Existing circuit modules face challenges in size reduction due to damage from laser processing and the need for thick metal components that sacrifice mounting area, leading to increased damage at corner portions and hindered size reduction.
Innovation Solution
A module design featuring a board with a first main surface, mounted components, a wire group, and a conductor via group that connects wires to a ground conductor, allowing for a shield to be disposed near components without damaging the wiring board, using a shield film and sealing resin to surround the components for protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If laser processing is used to form groove portions in sealing resin, then electrically conductive shields can be formed, but embedded components and wiring board may be damaged during processing
Solution Approach 1:
The shield structure is segmented into multiple parts: wire groups extending across components, conductor via groups connecting wires to ground conductors, and ground conductors disposed inside the board. This segmentation allows the shield to be formed without requiring deep groove portions in the sealing resin, thereby avoiding damage to embedded components and wiring board while maintaining shielding effectiveness.
2Strength
If thick metal components are formed on the wiring board to protect the wiring board, then the wiring board is protected, but the area for mounting components is reduced
Solution Approach 1:
The shield structure transitions from a two-dimensional thick metal layer on the wiring board surface to a three-dimensional configuration where ground conductors are disposed inside the board and wire groups extend across components. This dimensional change allows the shield to provide protection without occupying valuable mounting area on the wiring board surface.
3Volume of moving object
If the module size is reduced, then compactness is improved, but the shield cannot be properly disposed near mounted components
Solution Approach 1:
The shield structure is nested within the module configuration: ground conductors are disposed inside the board, wire groups extend across mounted components, and conductor via groups connect the wires to the ground conductors. This nested arrangement allows the shield to be effectively disposed near mounted components in a compact module configuration, maintaining shielding effectiveness while achieving size reduction.
Data Source
AI summary
A module includes: a board having a first main surface; a first component mounted on the first main surface; a first wire group including a plurality of wires disposed to extend across the first component; a first ground conductor disposed inside the board; and a first conductor via group including a plurality of via conductors that connect each of the wires belonging to the first wire group and the first ground conductor. The first component is surrounded by the first wire group, the first conductor via group, and the first ground conductor.