Shielded Circuit Module with Sloped Trenches
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Solution Overview
Problem
Existing circuit modules face challenges in achieving desirable shielding properties due to narrow trenches filled with conductive resin paste, which are difficult to widen in downsized designs, limiting the effective separation and mounting of mount components while preventing electromagnetic interference.
Innovation Solution
A circuit module design featuring trenches with side walls having specific slopes allows for full filling with shielding material, enhancing shielding effectiveness and enabling high-density mounting of components by forming an inner shield section within the trench and an outer shield section on the main surface, utilizing a conductive resin with higher thermal conductivity than the sealing material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If trenches are widened to improve shielding properties, then shielding effectiveness is improved, but area for mounting components is reduced
Solution Approach 1:
The shield is segmented into two distinct parts: an inner shield section formed within the trench and an outer shield section disposed on the main surface. This segmentation allows the shielding function to be distributed, enabling effective shielding without requiring a single large trench that would consume excessive mounting area.
Solution Approach 2:
The shield structure extends from the trench interior to the main surface, utilizing the vertical dimension. The inner shield section is formed within the trench while the outer shield section is disposed on the main surface, creating a multi-level shielding structure that improves shielding effectiveness without proportionally increasing the horizontal trench width.
2Productivity
If trenches are narrowed to increase component mounting density, then component density is improved, but shielding properties deteriorate
Solution Approach 1:
The shield is segmented into an inner shield section within the narrow trench and an outer shield section on the main surface. This segmentation allows the shielding function to be distributed, enabling effective shielding even when the trench width is reduced to accommodate higher component density.
Solution Approach 2:
The shield structure utilizes the vertical dimension by extending from the trench interior to the main surface. This allows the shielding effectiveness to be maintained through vertical arrangement rather than horizontal expansion, enabling narrow trenches that accommodate high-density component mounting.
3Ease of manufacture
If narrow trenches are filled with conductive resin paste, then manufacturing is simplified, but filling is insufficient and shielding properties deteriorate
Solution Approach 1:
The shield is segmented into an inner shield section formed within the trench and an outer shield section on the main surface. This segmentation ensures that the conductive resin paste can be effectively distributed and cured in both regions, achieving sufficient filling and continuous shielding coverage even in narrow trenches.
Solution Approach 2:
The shield structure extends vertically from the trench to the main surface, allowing the conductive resin paste to be applied and cured in a distributed manner. The inner shield section is formed within the trench while the outer shield section is formed on the main surface, ensuring adequate filling and continuous shielding coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design ensures effective shielding against electromagnetic interference, allows for high-density component mounting, and facilitates efficient heat dissipation through the inner shield section, addressing the limitations of narrow trenches in downsized modules.
Implementation Method 1
a surface of the sealing body is coated with a conductive material to be used as a shield against interruption induced by electromagnetic waves
Implementation Method 2
utilizing a conductive resin with higher thermal conductivity than the sealing material
Data Source
AI summary
A circuit module includes a circuit substrate, a mount component, a sealing body, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench formed from a main surface of the sealing body to the mount surface. The trench includes side walls configured of a first side wall at a mount surface side and a second side wall at a main surface side. A straight line connecting the first point and the second point has a second slope gentler than the first slope against the mount surface. The shield covers the sealing body and has an inner shield section formed within the trench and an outer shield section disposed on the main surface and the inner shield.