Shielded Electronic Component Layout to Prevent Mounting-Surface Shorts
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Solution Overview
Problem
Existing electronic components with shielding films on side surfaces can inadvertently deposit on mounting surfaces, leading to short circuits due to the sputtering process, where the substrate is oriented opposite to the target during film formation.
Innovation Solution
The electronic component design includes an insulating substrate with exposed ground electrodes, where the second ground electrode, closer to the mounting surface, has a thicker conductive film than the first, preventing unnecessary shielding film deposition on the mounting surface by adjusting the thickness and electrical resistivity of the conductive films to control the shielding film formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sputtering is performed with the insulating substrate placed such that the surface opposite to the mounting surface faces the target, then the shielding film is formed on the side surfaces, but the shielding film may be unnecessarily deposited on the mounting surface causing short circuits
Solution Approach 1:
The patent applies local quality by making the conductive films have different thicknesses at different locations. Specifically, the conductive film on the mounting surface has a greater thickness than the conductive film on the opposite surface, creating localized property differences that prevent harmful shielding film deposition where it is not needed while maintaining shielding functionality where required
Solution Approach 2:
The patent changes the parameter of conductive film thickness to control the sputtering process. By adjusting the thickness of conductive films at different locations (thicker on mounting surface, thinner on opposite surface), the patent modifies the deposition characteristics during sputtering to prevent unnecessary shielding film formation on the mounting surface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the likelihood of short circuits by preventing the shielding film from forming on the mounting surface, ensuring reliable operation of the electronic component.
Implementation Method 1
A shielding film on side surfaces of an insulating substrate may be formed by sputtering
Data Source
AI summary
An electronic component includes: an insulating substrate including a first main surface and a second main surface opposite to each other in a thickness direction and a side surface with a plurality of ground electrodes exposed thereto; conductive films each covering a surface of a corresponding one of the plurality of ground electrodes exposed to the side surface of the insulating substrate; and a shielding film covering the first main surface and the side surface of the insulating substrate and surfaces of the conductive films. The plurality of ground electrodes includes a first ground electrode and a second ground electrode, the first ground electrode and the second ground electrode being exposed to the side surface of the insulating substrate at a position closest to the first main surface and at a position closest to the second main surface, respectively.