Shielded Conductive Path Height Reduction via Segmented Shielding
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Solution Overview
Problem
Conventional shielded conductive paths in vehicles are bulky due to large spaces between wires, leading to inefficient heat dissipation and reduced contact area between wires and the shield, which hinders height reduction and thermal management.
Innovation Solution
The conductive members are arranged in parallel with individual shielding, where each member includes a conductor, insulating portion, and shield formed by shape retaining members, allowing for close contact and reduced height, with the conductor or insulating portion functioning as the shape retaining element, and the shield being formed by conductive metal or resin pipes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If wires are accommodated collectively in a shield pipe, then the structure is simple, but large spaces are formed in the height direction making it bulky
Solution Approach 1:
The patent divides the single collective shield pipe into multiple individual shield pipes, with each wire accommodated in its own shield. This segmentation eliminates the large void spaces that occur when multiple wires are bundled together in a single pipe, thereby reducing the overall height while maintaining structural simplicity through modular repetition.
2Device complexity
If wires are accommodated collectively in a shield pipe, then the structure is simple, but contact area between wires and shield is small reducing heat dissipation
Solution Approach 1:
By separating each wire into its own shield pipe, the patent maximizes the contact area between each wire and its corresponding shield. This individual accommodation ensures that heat generated in each wire can be efficiently dissipated through direct contact with the shield, eliminating the heat accumulation problem that occurs in collective accommodation where wires have limited contact with the shield.
3Length of stationary object
If individual shielding is used for each conductive member, then height is reduced and heat dissipation is improved, but device complexity increases
Solution Approach 1:
The patent merges the functions of multiple individual shield pipes into a single integrated shield structure. By combining the individual shields while maintaining their separate accommodation of each wire, the patent achieves both the height reduction and heat dissipation benefits of individual shielding, while simplifying the overall structure through integration, thereby counteracting the perceived increase in complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the overall height of the conductive path and enhances heat dissipation by eliminating unnecessary spaces and ensuring a larger contact area between conductors and shields, maintaining electrical characteristics and simplifying the design.
Implementation Method 1
even if heat is generated in the wires by energization, heat tends to accumulate in the shield pipe and there has been room for improvement in terms of heat dissipation
Data Source
AI summary
It is aimed to realize a height reduction of a shielded conductive path and improve a heat dissipating function. In a shielded conductive path (W) in which a plurality of conductive members (1) each including a conductor portion (2), an insulating portion (3) and a shield portion (4) disposed from a central part toward an outer peripheral side are arranged in parallel, at least one of the conductor portion (2), the insulating portion (3) and the shield portion (4) is formed by a shape retaining member capable of retaining each conductive member (1) in a set shape.