Shielded Conductive Pillar Structure for EMI Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Electromagnetic interference induced by wireless communication modules through conductive structures affects the performance of adjacent electronic modules in electronic devices.
Innovation Solution
A shielded conductive device with a dielectric base, conductive pillars, and a shielding layer on its lateral surface, connected to a reference conductive pillar to block electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wireless communication modules are electrically connected with other modules through conductive structures (e-bars), then signal transmission is enabled, but electromagnetic interference is induced that disturbs adjacent electronic modules
Solution Approach 1:
A dielectric base is introduced as an intermediary between the conductive pillars and the external environment. The dielectric material provides electrical insulation while allowing signal transmission through the conductive pillars, thereby mediating between the need for electrical connection and the need to block electromagnetic interference
Solution Approach 2:
A shielding layer is formed on the lateral surface of the dielectric base to create a protective barrier. This thin film structure blocks electromagnetic interference from propagating into the external space while maintaining the electrical connection function through the conductive pillars
2Object-affected harmful factors
If a shielding layer is added to block electromagnetic interference, then electromagnetic interference shielding is improved, but device complexity increases
Solution Approach 1:
The shielding layer is integrated with the dielectric base to form a unified structure. The conductive pillars extend through the dielectric base and connect to conductive pads on opposite surfaces, merging the insulation, connection, and shielding functions into a single integrated component rather than separate assembled parts
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents electromagnetic interference from propagating into the external space, enhancing the performance of adjacent electronic components.
Implementation Method 1
a shielding layer formed on the lateral surface of the dielectric base to reduce electromagnetic interferences propagating into an external space of the shielded conductive device
Data Source
AI summary
A shielded conductive device, a method for forming the same and an electronic package assembly is provided. The shielded conductive device comprises: a dielectric base having a top surface and a bottom surface, and a lateral surface extending between the top surface and the bottom surface; top conductive pads and bottom conductive pads formed on the top surface and the bottom surface of the dielectric base, respectively; a plurality of conductive pillars extending through the dielectric base and electrically connecting the top conductive pads with the bottom conductive pads, wherein the plurality of conductive pillars comprise at least one reference conductive pillar and at least one signal conductive pillar; and a shielding layer formed on the lateral surface of the dielectric base, and wherein the shielding layer is electrically connected to the at least one reference conductive pillar through at least a corresponding top conductive pad or bottom pad.