Shielded Conductor for Inductor Wiring Interaction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor devices, the mutual interaction between inductor elements and wiring above them leads to poor inductor element characteristics and increased chip area, as existing methods fail to effectively control these interactions while maintaining design freedom and minimizing surface area.
Innovation Solution
A semiconductor device with a multi-layer wiring structure that includes an inductor element, overhead wires, and a shielded conductor at a fixed voltage potential positioned between the inductor element and the wires, which suppresses the mutual interaction and allows for greater design freedom and reduced chip area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If wiring is positioned above the inductor element to ensure design freedom and minimal chip area, then chip area is reduced and design freedom is improved, but mutual interaction between the inductor element and wiring causes poor inductor element characteristics
Solution Approach 1:
An electromagnetic shielded conductor is introduced as an intermediary component positioned between the inductor element and the wiring above it. This shielded conductor blocks the magnetic flux generated by the inductor element, preventing mutual interaction with the overhead wiring while allowing both components to occupy the same vertical space, thereby reducing chip area without compromising inductor performance
Solution Approach 2:
The space above the inductor element is segmented into two functional zones: the lower region contains the inductor element for magnetic energy storage, while the upper region contains the wiring for signal transmission. The electromagnetic shielded conductor acts as a boundary between these zones, allowing independent optimization of each zone's function without interference
2Reliability
If the electromagnetic shielded conductor completely covers the inductor element, then mutual interaction is suppressed, but magnetic flux leakage to the upper section increases and inductor performance degrades
Solution Approach 1:
The electromagnetic shielded conductor is designed with non-uniform coverage: it partially covers the inductor element in regions where wiring is present to suppress mutual interaction, while leaving other regions uncovered or with reduced shielding to allow controlled magnetic flux leakage. This local differentiation optimizes both interaction suppression and magnetic flux management
Solution Approach 2:
Rather than completely covering the inductor element, the electromagnetic shielded conductor provides partial coverage only where necessary to suppress mutual interaction with overhead wiring. This partial action approach prevents excessive shielding that would cause magnetic flux leakage and performance degradation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses the mutual interaction between inductor elements and wiring, reducing chip area and design complexity, while maintaining stable inductor performance across various frequencies.
Implementation Method 1
an electromagnetic shielded conductor is formed above the inductor element... which suppresses the mutual interaction between the inductor element and the wiring
Data Source
AI summary
A semiconductor device effectively suppress the problem of mutual interaction occurring between an inductor element and wires positioned above the inductor element formed over the same chip. A semiconductor device includes a semiconductor substrate and a multi-wiring layer formed overlying that semiconductor substrate, and in which the multi-wiring layer includes: the inductor element and three successive wires and a fourth wire formed above the inductor element; and two shielded conductors at a fixed voltage potential and covering the inductor element as seen from a flat view, and formed between the inductor element and three successive wires and a fourth wire formed above the inductor element.