Shielded Connector Assembly for 112 Gbps Crosstalk Reduction
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Solution Overview
Problem
Conventional PCB wiring in communication devices faces significant loss and cannot meet the requirements for high-speed signal transmission beyond 56 Gbps, and existing connector assemblies suffer from crosstalk issues that hinder performance at 112 Gbps.
Innovation Solution
A connector assembly design featuring a metal housing with shield cavities, conducting pieces, and a shield layer with multiple electrical connecting parts facing different directions, along with staggered metal sheets forming rows of shield cavities, to reduce crosstalk and loop inductance, facilitating signal transmission at 112 Gbps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional PCB wiring is used for connection, then device integration is simple, but signal loss increases significantly at high speeds (56 Gbps and above)
Solution Approach 1:
The connector assembly is segmented into multiple functional components: shield cavity, conducting piece, wire, shield layer, and electrical connecting parts. This segmentation allows each component to be optimized for its specific function while maintaining overall performance at 112 Gbps and above
Solution Approach 2:
The wire is partially located inside the shield cavity and electrically connected to the conducting piece, creating a nested structure. The shield layer is wrapped around the wire, and electrical connecting parts are disposed on the shield layer, forming multiple nested levels that reduce signal loss through systematic shielding and containment
2Loss of energy
If connector assembly is used to reduce signal loss, then signal transmission performance improves, but crosstalk between signals increases at 112 Gbps
Solution Approach 1:
Different parts of the shield layer have different electrical connecting parts disposed on their outer surfaces, with each electrical connecting part facing a different direction and electrically connected to corresponding parts of the metal housing. This local differentiation optimizes shielding effectiveness for each signal path while minimizing crosstalk between adjacent signals
Solution Approach 2:
The shield layer acts as an intermediary between the wire and the external environment, while electrical connecting parts serve as intermediaries between the shield layer and the metal housing. This multi-level intermediary structure provides systematic shielding that reduces crosstalk while maintaining signal integrity
3Object-affected harmful factors
If shield cavity with conducting piece and wire is used, then signal shielding improves, but loop inductance increases affecting high-speed transmission
Solution Approach 1:
Electrical connecting parts are disposed on the outer surface of the shield layer in multiple different directions, creating a three-dimensional electrical connection pattern. This dimensional approach provides multiple return paths for signals, reducing loop inductance while maintaining comprehensive shielding effectiveness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces crosstalk and signal loss, enabling high-speed signal transmission up to 112 Gbps by optimizing the signal return path and loop inductance within the connector assembly.
Implementation Method 1
The shield layer is wrapped around the wire. At least two electrical connecting parts are disposed on an outer surface of the shield layer
Implementation Method 2
The at least two electrical connecting parts face different directions and are respectively electrically connected to parts, of the metal housing, that the at least two electrical connecting parts face
Data Source
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AI summary
A connector assembly (100) and a manufacturing method thereof, and an electronic device (1000) including the connector assembly (100) are disclosed. The connector assembly (100) includes a metal housing (10), a conducting piece (20), a wire (2), and a shield layer (2a). The metal housing (10) includes a shield cavity (11). The conducting piece (20) is accommodated in the shield cavity (11). The wire (2) is partially located in the shield cavity (11) and is electrically connected to one end of the conducting piece (20). The shield layer (2a) is wrapped around the wire (2). At least two electrical connecting parts are disposed on an outer surface of the shield layer (2a). The at least two electrical connecting parts face different directions and are respectively electrically connected to parts, of the metal housing (10), that the at least two electrical connecting parts face, to reduce impact of crosstalk of the connector assembly (100). The connector assembly (100) is intended to reduce impact of crosstalk of the connector assembly (100), to provide the connector assembly (100) and the electronic device (1000) that meet an application requirement of 112 Gbps.