Compact Shielded Connector Pair for High-Frequency Signal Reliability
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Solution Overview
Problem
Conventional connectors fail to accommodate the size reduction and increased signal speeds in modern electronic devices, lacking sufficient strength and electromagnetic shielding for high-frequency signals.
Innovation Solution
A connector pair design featuring a first connector with a high-frequency terminal and inner side shield, and a second connector with a high-frequency terminal and outer shield, where the shields are in contact to provide enhanced electromagnetic shielding and strength while maintaining a compact, low-profile form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the dimensions of the housing are reduced to achieve a compact and low-profile connector, then the connector size is reduced, but the strength becomes insufficient
Solution Approach 1:
The patent applies nesting by placing the inner side shield inside the housing, with the shield extending between terminals. This nested configuration allows the shielding structure to be integrated within the existing housing space without increasing external dimensions, thereby maintaining compact size while adding electromagnetic shielding functionality that reinforces structural integrity.
2Volume of moving object
If the dimensions of the housing are reduced to achieve a compact connector, then the connector size is reduced, but the electromagnetic shielding function becomes insufficient
Solution Approach 1:
The patent divides the shielding function into two separate components: an outer shield (conductive shell) and an inner side shield. This segmentation allows each shield to be optimized for its specific position and function, with the inner shield providing additional protection between terminals while the outer shield provides overall coverage, achieving superior electromagnetic shielding in a compact configuration.
Solution Approach 2:
The inner side shield is nested within the housing between the terminals, creating a multi-layer shielding structure. This nested arrangement enables the connector to maintain compact dimensions while incorporating enhanced electromagnetic shielding capabilities through the additional inner shield layer.
3Speed
If the connector is designed for high-speed signal transmission, then signal speed increases, but electromagnetic interference becomes more significant
Solution Approach 1:
The patent segments the shielding into outer and inner components, with the inner side shield specifically positioned between high-speed signal terminals. This segmentation provides targeted electromagnetic protection for high-frequency signals, reducing interference and crosstalk that become more significant at higher signal speeds.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The connector pair achieves high strength, reliable electromagnetic shielding, and effective transmission of high-frequency signals, even at compact dimensions, addressing the limitations of conventional connectors.
Implementation Method 1
a first shield surrounding an entire circumference of the first connector main body... a second shield surrounding an entire circumference of the second connector main body... the first shield and the second shield are in contact and electrically conducting
Data Source
AI summary
To exhibit high strength, achieve a high shielding effect, and increase reliability with a compact and low profile. A first connector that mates with a second connector, containing: a first connector main body; a first terminal attached to the first connector main body; a first high-frequency terminal attached to the first connector main body; and a first shield surrounding an entire circumference of the first connector main body; and further containing, a first inner side shield attached to the first connector main body and extending in a width direction of the first connector between the first terminal and the first high-frequency terminal; where a substrate connecting part of the first terminal is visible from a mating surface side of the first connector, and a substrate connecting part of the first inner side shield is not visible from the mating surface side.