Shielded Connector Heat Path for IC Cooling
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Solution Overview
Problem
Heat generated by ICs incorporated into connectors is not effectively released, leading to potential issues.
Innovation Solution
A connector device with a circuit board, a connector mounted on the board, and a heat transfer portion that transfers heat from the IC to a shield layer via an outer conductor, allowing for efficient heat dissipation through multiple pathways including the outer conductor and sub-ground circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If an IC is incorporated into the connector, then the connector functionality is enhanced, but heat generation becomes a problem
Solution Approach 1:
A heat transfer portion is introduced as an intermediary component between the IC and the outer conductor. This heat transfer portion (including heat dissipation sheet, metal plate, or conductive member) mediates the thermal energy transfer from the IC to the outer conductor, enabling effective heat dissipation while maintaining the IC's operational functionality within the connector
Solution Approach 2:
The outer conductor, which serves its primary electrical shielding function, is also utilized as a heat dissipation path. By converting the potentially harmful heat generation into a beneficial heat transfer mechanism through the shield layer, the design transforms a problem (heat accumulation) into a solution (passive heat sinking through the conductor and shield layer)
2Temperature
If heat transfer path is added to the connector, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The outer conductor and shield layer are designed to serve dual functions: electrical shielding and heat dissipation. This multi-functionality approach allows heat transfer without adding separate dedicated heat sinking components, thereby improving heat dissipation while minimizing increases in device complexity
Solution Approach 2:
The heat transfer portion is integrated with existing connector components rather than being completely separate. The heat dissipation sheet, metal plate, or conductive member is merged with the outer conductor structure, combining thermal management functionality with the existing electrical shielding structure to avoid excessive complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The connector device effectively releases heat from the IC to both the shield layer and main ground circuit, improving heat transfer efficiency and maintaining stable contact between components.
Implementation Method 1
a heat transfer portion that transfers heat of the IC to the shield layer
Data Source
AI summary
A connector device includes a circuit board and a connector mounted on the circuit board. The connector includes an outer conductor capable of electrical conduction with a shield layer of a shielded wire, a sub-board, an IC mounted on the sub-board, and heat transfer portions (a heat dissipation sheet, a metal plate, an outer conductor, and sub-ground circuits) that transfer heat of the IC to the shield layer. With this configuration, since the heat of the IC can be transferred to the shield layer of the shielded wire via the heat transfer portions, the heat of the IC can be readily released.