Shielded Connector With Integral Injection Molded Conductive Body

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Solution Overview

Problem

Conventional electrical connectors face issues with electromagnetic interference due to reduced pitch between terminals, leading to poor shielding effects and potential short circuits, especially as they age or when metal and insulating layers peel off, and the process of plating metal layers in narrow receiving holes is complex and inefficient.

Innovation Solution

A shielded connector design featuring a conductive body with integral injection molding, insulating members, and terminals with soldering portions and baffle structures, where the conductive body is made of metal or metal-infused plastic, and insulating layers are applied to prevent conduction and ensure even shielding, eliminating the need for pre-molded receiving holes and reducing the risk of metal layer peeling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the volume of the body becomes smaller and the number of terminals remains unchanged or increases, then the terminal pitch decreases, but electromagnetic interference among terminals worsens

Engineering Contradiction:
Improvevolume of connector bodyVSAvoidelectromagnetic interference
Core Design Contradiction:
Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality by plating metal layers specifically on the inner walls of receiving holes where terminals are located, rather than coating the entire connector body. This targeted approach provides electromagnetic shielding exactly where needed (around terminals) while maintaining a compact overall volume. The metal layer is applied locally to the critical areas experiencing electromagnetic interference.

Inventive Principle:
Principle #3Local quality

2Object-affected harmful factors

If a metal layer is plated in each receiving hole to shield electromagnetic interference, then electromagnetic shielding function is improved, but the metal layer and insulating layer are easily aged, broken or peeled off after long use

Engineering Contradiction:
Improveelectromagnetic shielding functionVSAvoidstability of metal and insulating layers
Core Design Contradiction:
Object-affected harmful factorsVSReliability

Solution Approach 1:

The patent employs composite materials by combining metal layers with insulating layers in a multi-layer plated structure on the receiving hole inner walls. This composite construction enhances both the electromagnetic shielding performance (through metal layers) and the long-term stability (through insulating layers that prevent oxidation and peeling). The layered composite structure mutual reinforcement each other's functions.

Inventive Principle:
Principle #40Composite materials

3Ease of manufacture

If liquid metal is flowed from above the receiving hole to plate the metal layer, then the receiving hole is filled with metal, but the upper part is thicker than the lower part resulting in uneven thickness

Engineering Contradiction:
Improvemetal layer plating processVSAvoiduniformity of metal layer thickness
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent inverts the conventional plating approach by using brush plating instead of liquid flow plating. Rather than allowing gravity to cause uneven distribution, the brush plating method applies metal material through controlled mechanical motion of a brush along the receiving hole inner wall, ensuring uniform thickness from top to bottom. This reverses the problematic gravity-driven flow approach.

Inventive Principle:
Principle #13The other way round (Inversion)

4Manufacturing precision

If brush plating is used to plate the metal layer in the receiving hole, then even thickness can be achieved, but a brush needs to be inserted into the receiving hole making the process complex

Engineering Contradiction:
Improveuniformity of metal layer thicknessVSAvoidplating process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies self-service by designing the brush plating process where the brush simultaneously performs multiple functions: it applies the metal layer, controls the thickness uniformly, and cleans the receiving hole inner wall during the same operation. The brush structure is designed to self-regulate the plating thickness through its own geometry and motion, reducing the need for additional control mechanisms or complex process steps.

Inventive Principle:
Principle #25Self-service

5Ease of manufacture

If the body having receiving holes is fabricated in advance, then the structure is prepared for terminal installation, but the process of plating metal layer and then insulating layer is complex

Engineering Contradiction:
Improvestructural preparation for terminalsVSAvoidmulti-step plating process
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent merges the metal layer plating and insulating layer plating processes into a single integrated operation. Instead of separately plating metal layers and then insulating layers in distinct steps, the process combines both functions in one continuous operation, reducing the total number of process steps. The brush plating system simultaneously deposits both metal and insulating materials in the required sequence and locations.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design simplifies the manufacturing process, stabilizes the shielding effect, and prevents short circuits by ensuring a nonconductive state between terminals and the conductive body, maintaining electromagnetic interference reduction without the risks of metal layer peeling or uneven plating.

Implementation Method 1

As metals can reflect, absorb and counteract electromagnetic waves, the metal layer may solve the problem of electromagnetic interference among terminals

Methodology Applied
Scientific EffectElectromagnetic wave reflection and absorption: Reflection

Implementation Method 2

The insulating layer is located between the terminal and the metal layer, and can prevent conduction between the two

Methodology Applied
Scientific EffectElectrical insulation: Electrical Resistance

Data Source

PatentUS8647153B2Shielded connector
Publication Date: 2014.02.11 LOTES
  • US8647153B2 patent drawing
  • US8647153B2 patent drawing
  • US8647153B2 patent drawing

AI summary

A shielded connector includes a conductive body having a plurality of receiving holes formed through, a plurality of insulating members respectively fixed in the receiving holes, and a plurality of terminals respectively fixed to the insulating members. Each terminal has a contact portion exposed upward to the insulating member and a soldering portion exposed downward to the insulating member. The terminal and the conductive body are in an nonconductive state. The conductive body is formed by integral injection molding, which does not require pre-molding an insulating body having a plurality of receiving holes and plating metal layers in the receiving holes, so that the process is simple yet novel and the problem that metal layers easily peel off is solved while ensuring a stable and good shielding effect.