Shielded Connector Structure for Heat Dissipation Without a Spacer
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Solution Overview
Problem
The existing connector designs require a spacer to stabilize the circuit board, making it difficult to downsize the connector.
Innovation Solution
A connector design that includes a circuit board connected via a signal wire, with heat transfer materials and conductive shells that cover the circuit board, eliminating the need for a spacer by thermally conducting heat away from the semiconductor element and fixing the circuit board directly to the shells.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a spacer is disposed between the shielding case and the circuit board to suppress unsteadiness, then the circuit board stability is improved, but the connector size increases
Solution Approach 1:
The patent merges the spacer function with the heat transfer material by making the heat transfer material also serve as the fixation material that suppresses circuit board unsteadiness. This integration eliminates the need for a separate spacer component, thereby reducing connector size while maintaining circuit board stability.
Solution Approach 2:
The heat transfer material is given multiple functions: it transfers heat from the circuit board to the shielding case, and simultaneously acts as a fixation material to suppress circuit board unsteadiness. This multi-functionality reduces the total component count and connector size.
2Temperature
If multiple shells and heat transfer materials are used to cover and thermally conduct the circuit board, then heat dissipation effectiveness is improved, but the device complexity increases
Solution Approach 1:
The patent combines the shielding case with heat transfer functionality by providing the shielding case with a heat transfer surface that contacts the circuit board. This integration eliminates the need for separate heat sink components while maintaining effective heat dissipation.
Solution Approach 2:
The shielding case serves dual purposes: it provides electromagnetic shielding and simultaneously acts as a heat transfer path. The fixation material also serves both as adhesive and as a thermal conduction path, reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for a downsized connector while maintaining effective heat dissipation and secure fixation of the circuit board, reducing the need for additional components and enhancing manufacturing efficiency.
Implementation Method 1
a first heat transfer material that is arranged on one principal surface of the circuit board... the second shell is thermally conductably connected to the circuit board in contact with the first heat transfer material
Implementation Method 2
covers at least a part of the target region in the one principal surface of the circuit board, is thermally conductably connected to the circuit board
Data Source
AI summary
A connector includes: a circuit board; a first heat transfer material arranged on a principal surface of the circuit board; a first shell having an end mated with a mating connector in a state in which the terminal end portion of the circuit board protrudes from the end, and includes an opposite opposed to at least a part of a target region which is a region other than the terminal end portion, covers at least a part of the target region, and is conductive; a second shell connected to an end of the first shell, covers at least a part of the target region of the principal surface, and is thermally conductably connected to the circuit board in contact with the first heat transfer material; and a third shell engaged with the second shell, covers at least a part of the target region of a principal surface, and is conductive.