Shielded Board Connector Plating Without a Solder Barrier
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Solution Overview
Problem
Conventional board-to-board connectors face challenges in maintaining suitable solder wettability and connection strength while reducing contact resistance, as forming a solder barrier to prevent solder spread increases terminal size and complicates the structure, which is difficult in smaller and lower profile connectors.
Innovation Solution
A connector design with a shield and housing that includes a nickel plating layer, a platinum group metal plating layer, and a gold plating layer, eliminating the need for a solder barrier, and ensuring the board connecting part is soldered around the entire periphery, with a flange that is continuous and a contact point part molded on the shield's sides.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a solder barrier is formed to prevent solder spread, then solder wettability and connection strength are improved, but terminal size increases and structure becomes complex
Solution Approach 1:
The invention extracts and eliminates the solder barrier structure from the terminal design. By using a triple-layer plating system (nickel, palladium, gold) with specific thickness ranges, the patent achieves solder prevention functionality without requiring a separate barrier structure, thereby reducing terminal size while maintaining connection reliability
Solution Approach 2:
The invention changes the parameters of the plating layers to achieve the desired functionality. By optimizing the thickness of each layer (nickel: 2-10μm, palladium: 0.1-1μm, gold: 0.05-0.5μm), the terminal achieves both solder wettability control and size reduction without requiring additional barrier structures
2Reliability
If a solder barrier is formed to prevent solder spread, then solder wettability is improved, but device complexity increases
Solution Approach 1:
The invention merges multiple functions into the plating layers. The triple-layer plating system simultaneously provides solder wettability control, corrosion resistance, and size reduction, eliminating the need for separate barrier structures and simplifying the overall terminal design
Solution Approach 2:
The plating layers serve multiple functions: the nickel layer provides corrosion resistance and structural stability, the palladium layer controls solder wettability and prevents solder spread, and the gold layer provides excellent electrical conductivity and oxidation resistance. This multi-functional approach eliminates the need for additional barrier structures
3Volume of moving object
If terminal size is reduced for smaller connectors, then connector profile is lowered, but forming a solder barrier becomes difficult
Solution Approach 1:
The invention changes the approach from structural barrier formation to material property control. By optimizing the thickness and composition of the plating layers, the patent achieves solder prevention functionality in miniaturized terminals without requiring complex barrier structures that would be difficult to manufacture at small scales
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design maintains solder wettability, improves connection strength, reduces contact resistance, simplifies the structure, and lowers costs without a solder barrier, enhancing reliability and compatibility with smaller, lower profile connectors.
Implementation Method 1
the contact point part and the board connecting part have a plurality of plating layers formed thereon... 863a is a nickel plating layer formed as a base layer on the metal base material 862... 863b is a palladium plating layer formed on the nickel plating layer 863a... 863c is a gold plating layer formed on the palladium plating layer 863b
Data Source
AI summary
A shield includes a main body part, a board connecting part at a first end of the main body part, and a contact point part at a second end of the main body part, and surrounds a periphery of the connector; the main body part, board connecting part, and contact point part include exposed surface exposed outside of a housing; the board connecting part is formed around the entire periphery of the connector; the main body part, board connecting part, and contact point part include a metal base material and first to third plating layers formed on the metal base material; and the first layer is a nickel or nickel alloy plating layer, the second layer is a platinum group metal or platinum group metal plating layer, the third layer is a gold or gold alloy plating layer, and a thickness of the third layer is 0.2 to 15 [nm].