Shielded Connection Component Structure for Solder Crack Isolation
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Solution Overview
Problem
Existing connection components in electronic devices face reliability issues due to elastic deformation causing stress and potential cracks in solder portions, which affects the stability of communication characteristics and overall device performance.
Innovation Solution
A connection component design featuring an elastic portion that elastically deforms without directly influencing the mounting portion, combined with a shield module that includes a shielding case, reduces the likelihood of stress-induced cracks and improves reliability by isolating the elastic deformation from the mounting area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the elastic portion directly connects to the mounting portion, then the connection component can be simpler in structure, but the elastic deformation causes stress and cracks in the solder portion reducing reliability
Solution Approach 1:
The connection component is divided into distinct functional sections: the elastic portion (with elastic arms for contact), the side wall portion (providing structural support and shielding), and the mounting portion (for circuit board attachment). This segmentation isolates the elastic deformation to specific regions away from the solder joints, preventing stress transmission while maintaining structural integrity and simplifying overall design.
2Ease of manufacture
If the elastic portion projects from the mounting portion, then assembly is easier, but the solder fillet interferes with elastic deformation impairing spring characteristics
Solution Approach 1:
The elastic portion is extracted from direct connection to the mounting portion and instead connected to the side wall portion. The side wall acts as an intermediary that isolates the elastic arms from the solder fillets during mounting. This allows the elastic portion to maintain its spring characteristics and deformation precision while still enabling easy assembly through the insertion section.
3Volume of moving object
If the connection component size is reduced, then device integration is improved, but the elastic portion may directly influence the mounting portion causing stress
Solution Approach 1:
The side wall portion extends in a direction perpendicular to both the elastic deformation direction and the mounting direction, creating a three-dimensional separation. This spatial arrangement allows the elastic portion to deform without transmitting stress to the mounting portion, even in compact designs. The side wall acts as a structural barrier that maintains reliability while enabling size reduction through efficient space utilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the reliability of electronic devices by minimizing the impact of elastic deformation on the mounting portion, reducing the likelihood of solder cracks and improving communication stability while allowing for efficient assembly and size reduction of the connection component and shield module.
Implementation Method 1
The elastic portion is to come into contact with the connection object... in a first direction in which the elastic portion deforms elastically
Data Source
AI summary
A connection component that connects a connection object to a circuit board includes an insertion section, an elastic portion, a side wall, and a mounting portion. The connection object is to be inserted to the insertion section. The elastic portion is to come into contact with the connection object. The side wall is connected to the elastic portion and extends in a first direction in which the elastic portion deforms elastically. The mounting portion is connected to the side wall, and the mounting portion is to be mounted on the circuit board.