Shielded Connector Wafer Assembly for High-Rate PCB Links
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Solution Overview
Problem
Existing I/O connectors are sensitive to small dimensional variations and difficult to construct and assemble due to the right-angle orientation of metal elements, which complicates the connection between host PCBs and module PCBs, especially at high data rates like 112 Gbits.
Innovation Solution
The design incorporates a housing with wafers featuring signal and ground conductors, flexible and rigid shields, where the flexible shield's cantilever spring end portions make contact with the rigid shield and ground conductors, providing mechanical and electrical connections, and the rigid shield is secured with welds and molding posts to enhance mechanical strength and signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal elements are oriented at a right angle to the PCB to connect host PCB to module PCB, then electrical connection between PCBs is achieved, but the construction and assembly becomes difficult
Solution Approach 1:
The connector is divided into multiple wafers (first wafer, second wafer, third wafer) that can be assembled in a stacked configuration. Each wafer contains specific electrical elements, allowing the complex right-angle connection to be broken down into simpler, modular components that are easier to manufacture and assemble individually while maintaining the overall electrical connection function.
2Productivity
If I/O connectors are configured as a stacked sandwich of wafers, then high data rate transmission is enabled, but the connector becomes sensitive to small dimensional variations
Solution Approach 1:
A flexible shield is incorporated into the connector assembly that can accommodate small dimensional variations between stacked wafers. The flexible nature of this shield allows it to compensate for manufacturing tolerances and maintain proper electrical contact and shielding effectiveness without requiring extremely tight dimensional control across all wafer interfaces.
3Reliability
If shields are added to provide mechanical strength and signal integrity, then protection and signal quality improve, but the device complexity increases
Solution Approach 1:
The shield structure is integrated with the existing wafer assembly rather than being added as a completely separate component. The flexible shield is positioned to work in conjunction with the rigid shields and existing conductor arrangements, merging the shielding function with the structural framework already present in the stacked wafer configuration, thereby reducing overall complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for high data rate transmissions while improving mechanical strength and signal integrity by ensuring reliable electrical and mechanical contacts, reducing assembly complexity, and maintaining signal quality.
Implementation Method 1
The flexible shield includes terminal end portions, cantilever spring end portions, and a flexible shield body between the terminal end portions and the cantilever spring end portions
Implementation Method 2
In some cases, the connector also includes welds between the rigid shield and the ground conductors
Data Source
AI summary
A number of connectors and related methods that allow for high data rate transmissions are described. An example connector includes a housing and a wafer. The water includes signal conductors, a ground conductors, a flexible shield, and a rigid shield. The flexible shield includes terminal end portions, cantilever spring end portions, and a flexible shield body between the terminal end portions and the cantilever spring end portions. The flexible shield body covers a first portion of the ground conductors, and the rigid shield covers a second portion of the ground conductors.