Power Converter Shielded Cooling Plate for Noise and Heat Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing power conversion devices face issues with noise and heat interference between high-voltage and low-voltage electronic components, leading to potential malfunctions, particularly in vehicles with electric motors.
Innovation Solution
A power conversion device with a cooling plate and a shield body that separates high-voltage and low-voltage electronic components, using a shield body branching from the cooling plate to block electromagnetic noise and heat, and a parallel shield portion to further protect low-voltage components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If high-voltage and low-voltage electronic components are accommodated in the same housing, then the power conversion device can be compact and integrated, but noise and heat from high-voltage components interfere with low-voltage components causing malfunctions
Solution Approach 1:
The housing is divided into a first space for high-voltage electronic components and a second space for low-voltage electronic components, with a wall portion separating the two spaces. This segmentation isolates the harmful noise and heat from high-voltage components while maintaining the integrated compact structure of the power conversion device.
Solution Approach 2:
A wall portion is introduced as an intermediary structure between high-voltage and low-voltage electronic components. This wall portion acts as a barrier that blocks noise and heat transmission from the high-voltage side to the low-voltage side, preventing interference while allowing both components to coexist in the same housing.
2Object-affected harmful factors
If a wall portion is added to separate high-voltage and low-voltage spaces, then noise and heat interference is reduced, but the device structure becomes more complex
Solution Approach 1:
The wall portion serving as a noise and heat barrier is merged with the cooling plate structure. The cooling plate has a first cooling fin in the first space and a second cooling fin in the second space, with the wall portion integrated between them. This merging reduces the number of separate components and simplifies the overall structure while maintaining effective separation.
Solution Approach 2:
The wall portion is designed to serve multiple functions simultaneously: it acts as a noise barrier, a heat barrier, and an structural support element. By making the wall portion multi-functional, the need for additional separate components is eliminated, thereby reducing structural complexity while effectively addressing noise and heat interference.
3Temperature
If cooling fins are added to cool electronic components, then heat dissipation is improved, but the device structure becomes more complex
Solution Approach 1:
The cooling plate with cooling fins is merged with the wall portion that separates high-voltage and low-voltage spaces. The cooling plate includes a first cooling fin extending into the first space and a second cooling fin extending into the second space, with the wall portion integrated between them. This merging allows the cooling function to be achieved without adding separate cooling structures, thereby maintaining structural simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents malfunctions by shielding low-voltage components from noise and heat interference, ensuring stable operation of the power conversion device.
Implementation Method 1
a cooling plate accommodated in the housing and configured to cool the power conversion circuit by using a cooling fluid
Implementation Method 2
a shield body branching and protruding from the cooling plate is disposed between the high-voltage electronic component and the low-voltage electronic component
Data Source
AI summary
A power conversion device includes: a housing; a power conversion circuit accommodated in the housing and configured to convert power; and a cooling plate accommodated in the housing and configured to cool the power conversion circuit by using a cooling fluid. The power conversion circuit includes a high-voltage electronic component through which high-voltage power flows and a low-voltage electronic component through which low-voltage power having a voltage lower than a voltage of the high-voltage electronic component flows. A shield body branching and protruding from the cooling plate is disposed between the high-voltage electronic component and the low-voltage electronic component in the power conversion circuit.