Shielded Detector Array Routing for Radiation-Hardened Electronics
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Solution Overview
Problem
Radiation photons that traverse the radiation detection sub-assembly interact with the electronics sub-assembly, causing damage and reducing its lifespan, introducing noise, and degrading its performance.
Innovation Solution
A detector array is designed with a routing sub-assembly comprising a dielectric material and a shielding material, such as tungsten or lead, to attenuate radiation that has traversed the detection sub-assembly, with conductive elements extending through openings to transmit signals between the detection and electronics sub-assemblies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If no shielding material is used, then the detector array structure is simpler and manufacturing is easier, but the electronics sub-assembly suffers radiation damage and has reduced lifespan
Solution Approach 1:
A routing sub-assembly is introduced as an intermediary component between the radiation detection sub-assembly and the electronics sub-assembly. This routing sub-assembly includes a shielding layer that attenuates radiation photons before they reach the electronics, thereby protecting the electronics while maintaining signal transmission functionality through conductive elements.
Solution Approach 2:
The detector array is divided into distinct functional sub-assemblies: a radiation detection sub-assembly for converting radiation to electrical charge, a routing sub-assembly with shielding material for protecting electronics, and an electronics sub-assembly for signal processing. This segmentation allows each component to perform its specific function optimally while isolating the electronics from radiation damage.
2Object-affected harmful factors
If shielding material is added to protect electronics, then radiation damage is reduced, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The shielding layer is nested within the routing sub-assembly, which itself is positioned between the radiation detection sub-assembly and the electronics sub-assembly. The conductive elements are embedded within or extend through the shielding layer, creating a nested structure where multiple functional elements are integrated into a single compact unit that is easier to manufacture as a complete assembly.
Solution Approach 2:
The routing sub-assembly merges multiple functions into a single component: it provides mechanical support for conductive elements, incorporates radiation shielding material to protect electronics, and enables signal transmission. This consolidation reduces the number of separate parts and simplifies the manufacturing process compared to adding separate shielding components.
3Object-affected harmful factors
If a complete shielding layer is used, then radiation protection is maximized, but signal transmission between sub-assemblies is blocked
Solution Approach 1:
The routing sub-assembly features localized variations in shielding properties: areas with higher radiation attenuation (shielding layers) are positioned where radiation protection is most needed, while areas with lower attenuation (conductive elements) are positioned where signal transmission is required. This local differentiation allows simultaneous optimization of both radiation protection and signal transmission in different regions of the same component.
Solution Approach 2:
Conductive elements serve as intermediary pathways that penetrate or are embedded within the shielding layer. These conductive elements allow electrical signals to pass through the routing sub-assembly while the surrounding shielding material attenuates radiation photons, enabling both functions to coexist in the same physical space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shielding material effectively reduces radiation exposure to the electronics sub-assembly, minimizing damage and noise, thereby extending its lifespan and improving system performance.
Implementation Method 1
a shielding material, such as tungsten or lead, to attenuate radiation that has traversed the detection sub-assembly
Data Source
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AI summary
A detector array for a radiation system includes a radiation detection sub¬ assembly, a routing sub-assembly, and an electronics sub-assembly. The routing sub¬ assembly is disposed between the radiation detection sub-assembly and the electronics sub-assembly and includes one or more layers of shielding material. For example, the routing sub-assembly may include a printed circuit board having embedded therein a shielding material configured to shield the electronics sub-assembly from at least some radiation. In some embodiments, the shielding material defines at least one opening through which a conductive element(s) passes to deliver signals between the radiation detection sub-assembly and the electronics sub-assembly.