Shielded Device Packages with Embedded Antennas for EMI Reduction
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Solution Overview
Problem
Existing electronic device packaging solutions for minimizing electromagnetic interference (EMI) often increase device size, cost, or complexity, and can impair antenna functionality, while existing EMI shielding methods are difficult to implement and may lead to mechanical failures.
Innovation Solution
A device package design featuring a frame structure embedded in molding compound, with a shielding structure electrically connected to the frame, providing lateral and orthogonal shielding, and an antenna structure with a conductive interconnect through the molding compound, allowing for efficient EMI shielding without compromising antenna operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a cover is provided over a semiconductor device package for EMI shielding, then EMI protection is improved, but the area footprint of the PCB increases and additional fabrication steps are required
Solution Approach 1:
The EMI shielding function is merged with the device package structure itself. The package substrate includes a ground plane layer and conductive shielding structures that are integrated during the standard packaging process, eliminating the need for separate EMI shields and their associated alignment and attachment steps.
Solution Approach 2:
The package substrate serves multiple functions: it provides mechanical support for the semiconductor devices, establishes electrical connections through conductive traces, and simultaneously provides EMI shielding through its ground plane and conductive structures. This multi-functionality eliminates the need for dedicated EMI shielding components.
2Object-affected harmful factors
If EMI shielding is implemented using existing solutions, then EMI protection is improved, but device size increases
Solution Approach 1:
The EMI shielding structures are nested within the device package footprint. The ground plane layer is positioned beneath the device array, and conductive shielding elements are embedded within or around the package substrate, allowing the shielding function to be contained within the existing device boundaries without expanding the overall footprint.
3Object-affected harmful factors
If EMI shielding is implemented using existing solutions, then EMI protection is improved, but device cost increases
Solution Approach 1:
The EMI shielding structures are combined with the package substrate fabrication process. The ground plane is formed as part of the substrate layer structure, and conductive shielding elements are created using the same lamination and patterning processes used for the circuit traces, eliminating the need for separate EMI shield components and their associated assembly costs.
4Object-affected harmful factors
If shielding structure is added to protect electrical components, then EMI protection is improved, but antenna functionality may be impaired
Solution Approach 1:
The EMI shielding is applied locally and selectively. The ground plane and conductive shielding structures are positioned to protect the electrical components while leaving the antenna region electrically isolated. The antenna is placed in a location where it does not interact with the shielding structures, or the shielding is interrupted in the antenna region to maintain signal integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces EMI susceptibility while maintaining antenna functionality, minimizing size and cost increases, and simplifying the fabrication process, thereby enhancing the reliability and performance of electronic device packages.
Implementation Method 1
a shielding structure that is electrically connected to the frame structure and that spans the one or more electrical components... providing lateral and orthogonal shielding
Implementation Method 2
an antenna structure with a conductive interconnect through the molding compound, allowing for efficient EMI shielding without compromising antenna operation
Data Source
AI summary
Shielded device packages and related fabrication methods are provided. An exemplary device package includes one or more electrical components, a molding compound overlying the one or more electrical components, a conductive interconnect structure within the molding compound, a conductive frame structure laterally surrounding the one or more electrical components and the interconnect structure, and a shielding structure overlying the one or more electrical components. The shielding structure is electrically connected to the frame structure and at least a portion of the molding compound resides between the shielding structure and the one or more electrical components.