Shielded Digital Isolator Layout for Smaller Die Area
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Solution Overview
Problem
Existing digital isolators have low substrate utilization and large die area, leading to higher die costs and inefficiencies in electrical isolation.
Innovation Solution
A digital isolator design that includes a first die with an electromagnetic shielding structure and an isolated transmission structure, where one encoding or decoding circuit is formed on the first die and the other on a separate second die, improving substrate utilization and reducing die area without compromising electrical isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical coupling, inductance/magnetic isolation, or capacitance isolation is used in existing digital isolators, then electrical isolation between digital and analog signals is achieved, but substrate utilization is low and die area is large
Solution Approach 1:
The patent merges the encoding circuit and decoding circuit onto a single substrate, eliminating the need for separate isolation components. The isolated transmission structure integrates both circuits in close proximity while maintaining electrical isolation through shared substrate connections, thereby reducing die area while preserving isolation functionality.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it acts as the mounting platform for both encoding and decoding circuits, provides electrical isolation between the two circuits, and enables signal transmission through the isolated transmission structure. This multi-functionality eliminates the need for additional isolation components, reducing overall die area.
2Reliability
If optical coupling, inductance/magnetic isolation, or capacitance isolation is used in existing digital isolators, then electrical isolation between digital and analog signals is achieved, but substrate utilization is low and die costs increase
Solution Approach 1:
By combining both encoding and decoding circuits on a single substrate, the patent reduces the total number of components and interconnections required. This integration simplifies the manufacturing process, reduces assembly steps, and lowers die costs while maintaining electrical isolation through the isolated transmission structure.
3Area of stationary object
If encoding and decoding circuits are integrated on the same substrate, then substrate utilization improves and die area reduces, but electrical isolation may be compromised
Solution Approach 1:
The substrate is segmented into distinct encoding and decoding circuit regions, with the isolated transmission structure providing clear spatial separation and electrical isolation between these regions. This segmentation allows both circuits to coexist on the same substrate while maintaining proper electrical isolation through the transmission structure design.
4Reliability
If existing isolation methods are used, then electrical isolation is maintained, but device complexity and die area are increased
Solution Approach 1:
The patent combines the isolation function with the signal transmission function in a single integrated structure. The isolated transmission structure simultaneously provides electrical isolation and signal coupling between encoding and decoding circuits, eliminating the need for separate isolation components and reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances substrate utilization, reduces die area and costs, while maintaining effective electrical isolation and improving electromagnetic compatibility.
Implementation Method 1
an electromagnetic shielding structure and an isolated transmission structure, where one encoding or decoding circuit is formed on the first die and the other on a separate second die
Implementation Method 2
an isolated transmission structure, where one encoding or decoding circuit is formed on the first die and the other on a separate second die
Data Source
AI summary
A digital isolator can include: a first die having one of an encoding circuit and a decoding circuit; a second die having one of the encoding circuit and the decoding circuit that is not in the first die, where the first die and the second die are separated from each other; and an isolated transmission structure configured to transmit an encoded signal generated by the encoding circuit to the decoding circuit.