Shielded Embedded Component Substrate for EMI and Thermal Management
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Solution Overview
Problem
The embedding of electronic components within substrates leads to electromagnetic interference due to close proximity with substrate circuit patterns and poor heat transfer due to the substrate being a poor thermal conductor, posing challenges in reducing package thickness and managing heat in high-power applications.
Innovation Solution
A shielded embedded electronic component substrate is created with a core dielectric layer and an electrically conductive die shield lining the die opening, where the electronic component is mounted within the die opening and shielded, allowing for effective heat dissipation to the die shield and ambient environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the electronic component is placed inside of an opening in the substrate to reduce package thickness, then the package thickness is reduced, but electromagnetic interference occurs between the electronic component and the substrate circuit patterns
Solution Approach 1:
A die shield structure is introduced as an intermediary element between the electronic component and the substrate circuit patterns. The die shield includes a first shield portion lining the sidewalls of the recess and a second shield portion extending onto the substrate, creating a physical and electromagnetic barrier that blocks interference while allowing the component to remain embedded for thickness reduction.
Solution Approach 2:
The die shield is segmented into two distinct portions: a first shield portion that lines the recess sidewalls and a second shield portion that extends onto the substrate surface. This segmentation allows each portion to perform its specific function - the first portion provides side shielding while the second portion provides base shielding and thermal conduction path.
2Length of moving object
If the electronic component is embedded inside of the substrate to reduce package thickness, then the package thickness is reduced, but heat transfer from the electronic component becomes problematic due to the substrate being a poor thermal conductor
Solution Approach 1:
The die shield acts as a thermal intermediary, providing a dedicated heat conduction path from the electronic component to the substrate. By using materials with higher thermal conductivity for the die shield, heat can be efficiently transferred from the component through the shield to the substrate and ambient environment, bypassing the poor thermal conduction properties of the surrounding substrate material.
Solution Approach 2:
The thermal conductivity parameter is improved by introducing the die shield structure made of thermally conductive material. This changes the thermal properties of the embedding structure, enabling effective heat dissipation while maintaining the embedded configuration for thin profile.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces electromagnetic interference and enhances heat dissipation, making the substrate suitable for high-power applications by maintaining a thin profile while effectively managing thermal issues.
Implementation Method 1
heat generated by the electronic component is dissipated to the die shield and to the ambient environment
Implementation Method 2
An electrically conductive die shield lines the die opening... where the die shield shields the electronic component
Data Source
AI summary
A shielded embedded electronic component substrate includes a core dielectric layer having a die opening. An electrically conductive die shield lines the die opening. An electronic component is mounted within the die opening and to the die shield, where the die shield shields the electronic component. By mounting the electronic component within the die opening, the shielded embedded electronic component substrate is made relatively thin. Further, heat generated by the electronic component is dissipated to the die shield and to the ambient environment. Accordingly, the shielded embedded electronic component substrate is well suited for use when the electronic component generates a significant amount of heat, e.g., in high power applications.