Shielded Flexible Flat Cable Without Insulating Layers
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Solution Overview
Problem
Current flexible flat cables face challenges in achieving optimal signal transmission characteristics, particularly in terms of insertion loss and characteristic impedance, due to the high dielectric constant and dissipation factor of insulating materials, which are also costly and complex in structure.
Innovation Solution
A flexible flat cable design that eliminates the need for insulating material layers by using a structure comprising bare wires sandwiched between bonding adhesive layers, with metal shielding layers attached directly to these adhesive layers through laminating adhesive layers, thereby controlling pitch and reducing material complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulating material layers are used to cover bare wires in flexible flat cables, then the structure provides electrical insulation, but the high dielectric constant and dissipation factor cause signal transmission delay and attenuation
Solution Approach 1:
The patent extracts and removes the insulating material layers from the cable structure, leaving only the bare wires, bonding adhesive layers, and metal shielding layers. This elimination of the insulating layer removes the source of dielectric loss while maintaining electrical insulation through the bonding adhesive layers with lower dielectric constants.
2Loss of energy
If insulating material layers with low dielectric constant are used, then signal transmission loss is reduced, but material selection is limited and cost increases
Solution Approach 1:
The bonding adhesive layers serve multiple functions simultaneously: they provide electrical insulation between adjacent wires, mechanically bond the metal shielding layers to the wire assembly, and offer flexibility in material selection. This multi-functionality eliminates the need for separate insulating material layers and expands material choices to include various adhesive types with different dielectric properties.
3Object-affected harmful factors
If metal shielding layers are attached to insulating material layers, then electromagnetic interference is shielded, but the structure becomes more complex and production cost increases
Solution Approach 1:
The patent merges the functions of insulating material layers and metal shielding layer attachment into a single integrated structure. The bonding adhesive layers directly bond the metal shielding layers to the bare wires, eliminating the need for separate insulating layers. This consolidation simplifies the overall cable structure while maintaining both electrical insulation and electromagnetic shielding functions.
4Ease of manufacture
If conventional insulating materials like PET are used, then manufacturing is easier, but the dielectric constant limits signal transmission performance
Solution Approach 1:
The patent changes the dielectric parameter of the insulation medium by replacing conventional materials like PET (dielectric constant 3.4-3.5) with bonding adhesive layers that have lower dielectric constants. This parameter change reduces dielectric loss and improves signal transmission performance while maintaining manufacturing simplicity through the use of adhesive bonding processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves reduced signal loss and impedance matching while minimizing production costs and simplifying the cable structure, maintaining high-frequency data transmission performance.
Implementation Method 1
an upper bonding adhesive layer and a lower bonding adhesive layer are used to bond a plurality of bare wires together
Implementation Method 2
an upper metal shielding layer and a lower metal shielding layer are adhesively attached to the outside of the upper and lower bonding adhesive layers
Data Source
AI summary
A flexible flat cable includes an upper bonding adhesive layer and a lower bonding adhesive layer bonded together, a plurality of bare wires being sandwiched, an upper metal shielding layer located on an upper side of the upper bonding adhesive layer and adhesively attached to the upper bonding adhesive layer, and a lower metal shielding layer located on a lower side of the lower bonding adhesive layer and adhesively attached to the lower side of the lower bonding adhesive layer.