Shielded Heat Sink Layout for Stable Power Module Control Signals
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Solution Overview
Problem
Existing power semiconductor modules suffer from significant radiated noise propagation that disrupts control signals, leading to operational failures and malfunctions due to the close proximity of power and control line parts within the heat sink.
Innovation Solution
The heat sink is designed with a shielding layer having electrical conductivity or magnetism, featuring through holes that allow only control line parts to extend to the rear surface, separating power and control line parts and incorporating a shielding layer to suppress noise propagation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If power and control line parts are placed close together within the heat sink, then device complexity is reduced and ease of operation is improved, but radiated noise from power lines disrupts control signals causing operational failures
Solution Approach 1:
The heat sink is divided into a front surface region and a rear surface region by a shielding layer. Power line parts are positioned on the front surface while control line parts are positioned on the rear surface, segmenting the heat sink to separate noisy power lines from sensitive control lines and eliminating noise disruption while maintaining integrated design benefits
Solution Approach 2:
A shielding layer made of magnetically conductive material is introduced as an intermediary between the power line parts and control line parts. This shielding layer acts as a mediator that blocks magnetic flux and radiated noise from reaching the control signals, allowing both power and control lines to coexist within the same heat sink structure without interference
2Reliability
If a shielding layer is added to the heat sink to block radiated noise, then reliability is improved by protecting control signals, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The shielding layer is designed to serve multiple functions simultaneously: it provides electromagnetic shielding for control signals, acts as a structural component of the heat sink, and can be integrated with existing manufacturing processes. By making the shielding layer multi-functional, the patent reduces the need for additional separate shielding components, thereby limiting the increase in device complexity while maintaining improved reliability
3Reliability
If a shielding layer is added to the heat sink to block radiated noise, then reliability is improved by protecting control signals, but ease of manufacture deteriorates
Solution Approach 1:
The shielding layer is designed with specific material parameters (magnetic conductivity) and geometric parameters (thickness, position) that can be optimized to achieve effective noise shielding. By carefully selecting and adjusting these parameters, the patent ensures that the shielding layer provides sufficient protection for control signals while remaining compatible with standard manufacturing processes and materials, thus limiting the impact on ease of manufacture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively shields radiated noise, stabilizing control signals and reducing the risk of operational failures by minimizing noise interference between power and control line parts.
Implementation Method 1
The heat sink includes a shielding layer formed from a material having at least one of electrical conductivity and magnetism
Implementation Method 2
a heat sink including a front surface on which the power semiconductor element is installed and a rear surface opposite the front surface, and capable of dissipating heat from the power semiconductor element
Data Source
AI summary
A power semiconductor module includes a power semiconductor element having a first electrode, a second electrode, and a control electrode. The power semiconductor element is configured to selectively control a conductivity state between the first electrode and the second electrode. The power semiconductor module further includes a first power line electrically connected to the first electrode, a second power line electrically connected to the second electrode, a first control line electrically connected to the control electrode, a second control line electrically connected to the second electrode, and a heat sink having a front surface on which the power semiconductor element is formed. The heat sink includes a shielding layer. The first control line and the second control line extend through the heat sink.