Shielded IC Package Apertures for EMI Blocking

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Solution Overview

Problem

Integrated circuit package systems face challenges in preventing electromagnetic interference while allowing for easy encapsulation of semiconductor components, as existing shielding methods either fail to block disruptive energy or require openings that compromise protection.

Innovation Solution

The solution involves forming apertures in a shield attached to the substrate, which allows encapsulation material to flow through and protect semiconductor devices while blocking or absorbing electromagnetic radiation, thereby preventing interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a shield is provided to block electromagnetic radiation, then electromagnetic interference is prevented, but the shield must have openings for encapsulation which compromises the shielding effectiveness

Engineering Contradiction:

Improveshielding effectivenessVSAvoidencapsulation process

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The shield is segmented to include apertures that allow encapsulant flow while maintaining electromagnetic shielding through strategically positioned openings that minimize radiation leakage paths

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A conformal coating is applied as an intermediary layer over the shield apertures and electronic components, providing both encapsulation protection and enhanced electromagnetic shielding by filling the aperture openings

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If a conformal coating is applied to provide additional shielding and protection, then electromagnetic radiation blocking is improved, but the manufacturing process complexity increases

Engineering Contradiction:

Improveelectromagnetic radiation blockingVSAvoidmanufacturing process

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The conformal coating process merges multiple functions into a single manufacturing step: it provides encapsulation protection, fills shield apertures to block electromagnetic radiation, and creates a uniform dielectric environment, thereby reducing overall process complexity despite adding a manufacturing step

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The conformal coating serves multiple functions simultaneously: electromagnetic shielding enhancement, physical protection against moisture and oxidation, and dielectric stabilization, making the manufacturing process more efficient by consolidating multiple protection mechanisms into one application

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the reliability of semiconductor devices by preventing moisture and oxidation, providing a uniform dielectric environment, and securing the shield to the substrate, while effectively blocking disruptive electromagnetic energy.

Implementation Method 1

configuring the shield to block electromagnetic radiation that passes through the apertures

Methodology Applied

Scientific EffectElectromagnetic radiation blocking: Absorption (EM radiation)

Data Source

PatentUS7923822B2Integrated circuit package system including shield

Publication Date: 2011.04.12 STATS CHIPPAC MANAGEMENT PTE LTD

AI summary

An integrated circuit package system includes: a substrate; a first device attached to the substrate; a shield attached to the substrate and surrounding the first device; apertures formed within the shield; the shield configured to block electromagnetic energy that passes through the apertures; and an encapsulation material deposited through the apertures.