Insulating Layer Layout With Shield Conductor for Withstand Voltage
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Solution Overview
Problem
The electric field concentration between low and high voltage patterns in electronic components tends to concentrate at the high voltage pattern, leading to a decrease in withstand voltage.
Innovation Solution
Incorporating a shield conductor layer around the high voltage pattern and using high voltage dummy patterns between adjacent high voltage patterns to shield the electric field and suppress concentration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a high voltage pattern is formed in the insulating layer to handle high voltage applications, then the voltage handling capability is improved, but electric field concentration occurs at the high voltage pattern which decreases withstand voltage
Solution Approach 1:
A shield conductor layer is introduced as an intermediary element between the low voltage pattern and the high voltage pattern. This shield layer acts as a mediator that redistributes the electric field lines, preventing direct concentration at the high voltage pattern edges. The shield conductor is connected to a potential that is intermediate between the low and high voltage potentials, creating a gradual potential transition zone that reduces electric field intensity at critical interfaces.
Solution Approach 2:
The problem of electric field concentration in the planar dimension is addressed by extending the solution into the vertical dimension. The shield conductor layer is positioned at a specific height above the high voltage pattern, creating a three-dimensional electric field distribution. This vertical positioning allows the shield to intercept and redistribute electric field lines before they concentrate at the high voltage pattern edges, effectively using the Z-dimension to solve a two-dimensional problem.
2Reliability
If the shield conductor layer is positioned close to the high voltage pattern to effectively suppress electric field concentration, then the withstand voltage is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The shield conductor layer and its supporting protrusions are formed as integral structures during the manufacturing process, before final assembly. The protrusions that provide mechanical support and positioning for the shield conductor are created in advance during the insulating layer formation process, ensuring that the shield conductor is pre-positioned at the correct height and location. This preliminary structuring reduces the need for high-precision positioning during subsequent assembly steps.
Solution Approach 2:
The shield conductor is implemented as a thin film layer deposited on the insulating layer, rather than a rigid thick structure. This thin film approach allows the shield conductor to conform to the underlying insulating layer surface and protrusion structures, providing tolerance to manufacturing variations. The thin film nature also reduces the overall height requirements while maintaining the electric field shielding function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses electric field concentration at the high voltage pattern, thereby improving the withstand voltage of the electronic component.
Implementation Method 1
a shield conductor layer that is formed in the insulating layer such as to be positioned in a periphery of the high voltage pattern in plan view, shields an electric field formed between the low voltage pattern and the high voltage pattern
Data Source
AI summary
An electronic component includes an insulating layer that has a principal surface, a passive device that includes a low voltage pattern that is formed in the insulating layer and a high voltage pattern that is formed in the insulating layer such as to oppose the low voltage pattern in a normal direction to the principal surface and to which a voltage exceeding a voltage to be applied to the low voltage pattern is to be applied, and a shield conductor layer that is formed in the insulating layer such as to be positioned in a periphery of the high voltage pattern in plan view, shields an electric field formed between the low voltage pattern and the high voltage pattern, and suppresses electric field concentration with respect to the high voltage pattern.