Shielded Integrated Connector Modules for EMI Noise Isolation
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Solution Overview
Problem
Existing integrated connector modules fail to provide comprehensive noise shielding, particularly against externally and internally generated electromagnetic interference (EMI), leading to decreased signal-to-noise ratio and increased noise leakage between connectors, which is exacerbated by high-speed data requirements and component density, while also being costly and bulky.
Innovation Solution
An integrated connector module design featuring a connector housing with EMI-reducing shields and insert body shields that isolate electronic components, along with a mechanical latching mechanism for securing the EMI collar, providing additional grounding tabs and internal shielding to minimize noise interference and maintain a compact size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an external metallic wrap-around noise shield is used, then external EMI shielding is provided, but the bottom surface and port areas remain unshielded, decreasing overall noise performance
Solution Approach 1:
The shield is divided into multiple segments: an external wrap-around shield for external EMI, internal partition walls separating connector cavities for cross-connector noise isolation, and a bottom shield for complete coverage. This segmentation allows each part to address specific shielding needs without compromising overall performance.
Solution Approach 2:
The shielding approach extends from a single external wrap-around structure to a multi-dimensional shielding system that includes external shields, internal partition walls, and bottom shields, covering all surfaces including previously unshielded areas like the bottom surface and port regions.
2Volume of moving object
If internal electronic components are densely packed to reduce size, then component density increases, but cross-connector noise leakage increases
Solution Approach 1:
The internal volume is segmented into separate cavities using partition walls that extend from the bottom shield to the top surface. Each cavity houses specific electronic components for individual connectors, physically isolating them to prevent cross-connector noise leakage while maintaining high component density within the compact module.
Solution Approach 2:
Electronic components are nested within individual cavities that are themselves nested within the overall module housing. The partition walls create nested structures where each connector's components are contained within their own isolated space, reducing noise interference while maximizing space utilization.
3Object-affected harmful factors
If comprehensive noise shielding is implemented, then EMI protection is improved, but manufacturing cost increases
Solution Approach 1:
Multiple shielding functions are merged into an integrated shield structure that combines external wrap-around shielding, internal partition walls, and bottom shielding into a single cohesive component or assembly. This merging reduces the number of separate parts and assembly steps, lowering manufacturing cost while maintaining comprehensive EMI protection.
Solution Approach 2:
The shield structure serves multiple functions simultaneously: it provides external EMI shielding, internal cross-connector noise isolation, and complete surface coverage including bottom and port areas. This multi-functionality eliminates the need for separate shielding components for each function, reducing overall manufacturing complexity and cost.
4Object-affected harmful factors
If shield structure is added to improve noise performance, then EMI shielding is enhanced, but device complexity increases
Solution Approach 1:
The shield components are merged with the housing structure, where partition walls and bottom shields are integrated into the overall housing design rather than being separate add-on components. This integration simplifies the device structure by combining shielding functions with the existing housing geometry.
Solution Approach 2:
The housing structure serves dual purposes: it provides mechanical enclosure for the module and simultaneously serves as the shielding structure through integrated partition walls and bottom shields. This multi-functionality reduces device complexity by eliminating the need for separate dedicated shielding components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances external and internal noise suppression, maintains high-speed data performance, and reduces manufacturing costs, while allowing for miniaturization and improved reliability by providing comprehensive noise shielding without increasing the component's size or complexity.
Implementation Method 1
EMI reducing shields that isolate each of the sets of electronic components from one another
Implementation Method 2
An EMI reducing shield is also included in each of the insert bodies to facilitate the electrical isolation of each of the sets of electronic components from one another
Data Source
AI summary
High electrical isolation connector apparatus and methods. In one embodiment, an integrated connector module (ICM) is disclosed. The ICM includes a number of adjacent electronic subassemblies that are shielded through the use of an insert body shield. The insert body shield beneficially increases electrical isolation between adjacent subassemblies thereby further mitigating possible electrical noise. The insert body shield is configured to be received within a slot formed within the connector housing. An internal shield is also included that is received in a slot of an insert body of the electronic sub-assemblies, thereby effectively shielding adjacent component receiving cavities from one another. Methods and apparatus are also disclosed which make use and take advantage of these shielded ICMs. For example, telecommunications/networking equipment that incorporates these ICMs are also disclosed.