Shielded Interposer Frame for Detachable High-Density PCB Connections
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing interconnection methods, such as soldering, are impractical for repairing or testing electronic devices due to their non-separable nature and cost or contact density limitations, making it difficult to detachably connect semiconductor devices like printed circuit boards in compact and high-density electronic systems.
Innovation Solution
A scalable, detachable interconnect system featuring a shielded-frame structure with alignment features and compliant spring connectors that securely align and protect electrical contacts, providing electromagnetic interference shielding, resilience, and reusability, allowing for reliable electrical coupling of semiconductor devices while preventing over-compression of interposer contacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If soldering is used to connect PCBs, then connection density and compactness are improved, but repairability and reusability deteriorate
Solution Approach 1:
The interconnection system is divided into separate, detachable components including a first interposer block, a second interposer block, and a frame structure that can be assembled and disassembled. This segmentation enables high connection density through precise alignment features while maintaining repairability by allowing individual components to be replaced without damaging other parts of the system.
Solution Approach 2:
The system employs dynamic, reversible connection mechanisms rather than permanent solder joints. The detachable interposer blocks with alignment features enable the system to transition between connected and disconnected states, providing both high connection density when assembled and full repairability when disassembled for maintenance or upgrades.
2Ease of repair
If separable interconnect schemes like pogo pins are used, then repairability and reusability are improved, but contact density and cost limitations worsen
Solution Approach 1:
The interposer blocks are nested within a frame structure that provides structural support and alignment. This nesting arrangement enables high contact density by efficiently utilizing the available space, while the nested design maintains separability for repairability and reusability without requiring excessive contact points.
Solution Approach 2:
The frame structure acts as an intermediary element that enables high-density connections between interposer blocks while maintaining detachability. The alignment features on the frame and interposers work together to achieve precise positioning for high contact density, while the modular nature preserves repairability and reusability.
3Area of stationary object
If compact interconnect schemes are used, then footprint size is reduced, but electromagnetic interference increases
Solution Approach 1:
The frame structure extracts and isolates electromagnetic interference by providing a shielded environment for the high-density interconnections. This allows compact footprint size while reducing EMI through the frame's shielding capabilities, separating the harmful electromagnetic effects from the signal paths.
Solution Approach 2:
The frame structure converts the potentially harmful electromagnetic interference generated by high-density connections into a manageable phenomenon through shielding. The compact design benefits from the frame's ability to contain and redirect electromagnetic fields, turning what would be interference into a controlled environmental factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The interconnect system enables secure, efficient, and reusable electrical connections with enhanced electromagnetic shielding and mechanical resilience, facilitating the assembly and testing of complex electronic devices like mobile phones by allowing for easy detachment and reconnection of semiconductor components.
Implementation Method 1
a frame housing configured to secure the one or more interposer blocks in a fixed location on the frame housing and protect the compliant springs from over compression when in contact with a first semiconductor device
Implementation Method 2
The first end of each conductor forms a compliant spring that is electrically coupled to a corresponding signal contact
Data Source
AI summary
A scalable, detachable interconnect system is provided that includes a shielded-frame structure having alignment features that forms a separable interconnect assembly which can be used to electrically couple at least two semiconductor devices. The interconnect system functions to protect, secure, and align electrical contacts on a first and a second semiconductor device coupled together. In this manner, the interconnect assembly realizes an electrical-mechanical interposer system that can securely connect semiconductor devices (e.g., printed circuit boards and semiconductor device packages) together while presenting electrical optimization features such as internal ground shielding and mechanical properties such as resilience, compliance, reusability, and reliable scrub motion to remove oxide from the pads or bumps.