Shielded Inverted Stacking Module for EMI Shielding
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Solution Overview
Problem
Current multi-chip modules face challenges in increasing semiconductor die density on PCB assemblies due to bulkiness, inefficient use of space, and lack of effective electromagnetic interference (EMI) shielding, particularly in lateral shielding and connecting shields to a ground loop with minimal lead connections.
Innovation Solution
A package system incorporating a base package substrate with conductive elements, an internal stacking module with a semiconductor die and encapsulant, and an electromagnetic interference shield with an outside face, mounted over the base substrate and encapsulated with a second encapsulant, which also connects directly to the base package substrate for reduced size and improved shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multi-chip modules are arranged vertically to increase density, then board space efficiency is improved, but electromagnetic interference shielding becomes insufficient
Solution Approach 1:
The patent implements nested shielding structures where an inner shield is placed within the vertical stacking module and an outer shield surrounds the entire module. This nested configuration provides comprehensive EMI shielding while maintaining the compact vertical form factor, resolving the contradiction between space efficiency and shielding effectiveness.
Solution Approach 2:
The patent applies different shielding configurations to different regions: the inner shield provides localized shielding for sensitive components within the stacking module, while the outer shield provides comprehensive shielding for the entire assembly. This differentiated approach optimizes shielding effectiveness without compromising the compact vertical design.
2Device complexity
If conventional multi-chip modules are assembled before testing, then manufacturing complexity is reduced, but reliability decreases due to inability to identify known-good-die
Solution Approach 1:
The patent enables preliminary testing of individual dies before assembly into the vertical stacking module. By testing dies in advance and identifying known-good-die, the system ensures higher reliability while maintaining manufacturing feasibility through pre-screened components.
3Object-affected harmful factors
If shield connections use multiple lead connections, then electromagnetic interference shielding effectiveness is improved, but package size increases
Solution Approach 1:
The patent merges the shield connection function with existing structural elements of the vertical stacking module. By integrating shield connections into the module's inherent architecture rather than adding separate connection structures, the design achieves effective EMI shielding without increasing package size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances EMI shielding, reduces package size, and improves reliability by minimizing the path to ground and expanding shielding capabilities, while maintaining compactness and efficiency.
Implementation Method 1
covering at least portions of the first encapsulant in the internal stacking module with an electromagnetic interference shield
Data Source
AI summary
A method of manufacture of a package system includes: providing a base package substrate having conductive elements; providing an internal stacking module having a semiconductor die mounted on a package substrate and a first encapsulant surrounding at least portions of the semiconductor die and the package substrate; covering at least portions of the first encapsulant in the internal stacking module with an electromagnetic interference shield, the electromagnetic interference shield shaped to have an outside face; mounting the internal stacking module over the base package substrate with the outside face of the electromagnetic interference shield facing the base package substrate; and encapsulating at least portions of the internal stacking module, the electromagnetic interference shield, and the base package substrate using a second encapsulant.