Shielded Modular Jack Interface Module Bond Bar Grounding
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Solution Overview
Problem
Existing interface modules do not accommodate and properly bond or ground shielded modular jacks, which are larger due to metal housings, and fail to create an effective electrical connection between these jacks and patch panels.
Innovation Solution
The interface module features a housing with bond bars that engage both the shielded modular jacks and the patch panel, creating an electrical connection and ground path, using conductive plating or metalization to ensure secure bonding and grounding of shielded jacks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If shielded modular jacks with metal housings are used to meet performance requirements, then shielding effectiveness is improved, but the size of the jack increases and existing interface modules cannot accommodate them
Solution Approach 1:
The interface module is divided into separate functional components: a housing structure that accommodates multiple jacks, and a separate bond bar that provides electrical connection. This segmentation allows the housing to maintain compact dimensions while the bond bar extends to provide necessary electrical pathways, resolving the conflict between compact jack size and effective shielding connection.
Solution Approach 2:
The bond bar extends in a direction perpendicular to the plane of the jack openings, creating an electrical connection pathway in a different dimension. This allows the jack housing to remain compact in the primary dimensions while the bonding function is achieved through extension in the vertical dimension, effectively connecting shielded jacks to the patch panel ground without increasing jack footprint.
2Ease of operation
If existing interface modules are used, then mounting simplicity is maintained, but they fail to create effective electrical connection and grounding for shielded jacks
Solution Approach 1:
The bond bar serves multiple functions simultaneously: it provides electrical connection between shielded jacks and the patch panel, establishes grounding pathways, and maintains mechanical support for the jack assembly. This multi-functionality ensures reliable electrical connection without complicating the mounting process, as the bond bar is integrated into the existing interface module structure.
Solution Approach 2:
The bond bar acts as an intermediary element between the shielded modular jacks and the patch panel. It provides the necessary electrical pathway that connects the shielded components to the panel's grounding system, ensuring effective electrical connection and grounding while maintaining the simplicity of the overall mounting structure.
3Productivity
If multiple shielded jacks are mounted simultaneously, then productivity is improved, but ensuring proper bonding and grounding for all jacks becomes more complex
Solution Approach 1:
Multiple bond bars are combined into a single integrated bonding structure that simultaneously connects multiple shielded jacks to the patch panel. This merged bonding structure provides electrical connection and grounding for all jacks in unison, eliminating the need for individual bonding configurations and simplifying the overall installation process while maintaining high productivity.
Solution Approach 2:
The integrated bond bar structure provides universal electrical connection and grounding capability for multiple shielded jacks simultaneously. Each bond bar is designed to engage with the shielding of its respective jack while all are connected to the common panel ground, ensuring proper bonding and grounding configuration is achieved automatically through the design rather than requiring complex manual configuration.
Data Source
AI summary
An interface module includes a housing having a plurality of jack openings configured to receive shielded modular jacks therein. The housing has a mounting wall extending along one side of the jack openings. A bond bar is coupled to the mounting wall, wherein the bond bar has a jack interface configured to engage respective ones of the shielded modular jacks and a panel interface configured to engage a mating surface of a panel. The bond bar is configured to create an electrical connection between respective ones of the shielded modular jacks and the mating surface of the panel.