Shielded Lead Package Layout for High-Voltage Leakage Isolation
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Solution Overview
Problem
Microelectronic devices operating at several hundred volts require heatsinks, but existing attachment methods do not adequately address current leakage concerns when using thermally conductive materials.
Innovation Solution
A microelectronic device design featuring a package substrate with an exposed surface, an electrically connected lead extending away from the substrate, and a shielding dielectric material that laterally surrounds the lead to prevent leakage current, integrated into an electronic system with a circuit board and a heatsink attached to the substrate for efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermally conductive material is used to attach heatsink to microelectronic device, then heat transfer efficiency is improved, but current leakage occurs between heatsink and lead
Solution Approach 1:
The package substrate is divided into multiple isolation regions that segment the electrical pathways. Each region is electrically isolated from adjacent regions, preventing current leakage while maintaining thermal conduction pathways for efficient heat transfer from the electronic component through the substrate to the heatsink.
Solution Approach 2:
The package substrate acts as an intermediary element between the electronic component and heatsink. It provides both electrical isolation (preventing current leakage) and thermal conduction (enabling heat transfer) simultaneously, resolving the contradiction between thermal efficiency and electrical isolation.
2Temperature
If heatsink is attached to microelectronic device operating at high voltage, then thermal management is improved, but reliability decreases due to current leakage
Solution Approach 1:
The package substrate is segmented into multiple electrically isolated regions that prevent leakage current while maintaining thermal conduction pathways, thereby improving both thermal management and device reliability simultaneously.
Solution Approach 2:
Different regions of the package substrate have different electrical properties - some regions provide thermal conduction while adjacent regions provide electrical isolation. This local differentiation of material properties allows the substrate to simultaneously achieve thermal management and prevent current leakage, enhancing overall device reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces or prevents leakage current between the heatsink and the lead, enabling more efficient heat transfer from the electronic component to the heatsink, thereby enhancing the reliability and performance of microelectronic devices.
Implementation Method 1
a shielding dielectric material that laterally surrounds the lead and shields the lead from the exposed surface of the package substrate
Implementation Method 2
The heatsinks are commonly attached to the microelectronic devices using thermally conductive material
Data Source
AI summary
A microelectronic device includes one or more electronic components attached to a package substrate which has an exposed surface to provide an area for mounting a heatsink. The microelectronic device includes one or more leads that are electrically connected to the electronic component. The lead extends away from the exposed surface of the package substrate. The microelectronic device includes a shielding dielectric material that laterally surrounds the lead and extends over the lead between the lead and the exposed surface of the package substrate. An electronic system includes the microelectronic device and a circuit board electrically connected to the lead. The electronic system also includes a heatsink attached to the exposed surface of the package substrate.