Shielded Microstrip Line Layout for 5G RF Isolation and Low Loss
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Solution Overview
Problem
Existing signal lines in 5G mobile communication environments face challenges with coaxial cables being expensive and requiring large space, while micro-strip lines suffer from reduced isolation due to open surfaces, leading to increased line loss and parasitic resonance.
Innovation Solution
The electronic device incorporates a micro-strip line protected by a shielding structure formed using a conductive member, which reduces transmission loss and suppresses parasitic resonance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a micro-strip line is used in 5G mobile communication environment, then line loss is reduced compared to strip-line, but isolation is worsened because one surface is open to air
Solution Approach 1:
The shielding structure is divided into multiple segments including a first shielding structure above the micro-strip line and a second shielding structure below it. This segmentation allows the shielding function to be distributed while maintaining the open surface advantage of the micro-strip line for reduced line loss.
Solution Approach 2:
Ground planes are introduced as intermediary elements between the micro-strip line and the surrounding environment. These ground planes form capacitive coupling with the signal line, providing shielding and isolation without requiring complete enclosure, thus maintaining the benefits of the open micro-strip configuration.
2Object-affected harmful factors
If a strip-line is used in 5G mobile communication environment, then isolation is improved by surrounding the signal line with ground shielding, but line loss increases compared to micro-strip line
Solution Approach 1:
The shielding is applied locally rather than completely enclosing the signal line. The first and second shielding structures are positioned strategically above and below the micro-strip line, providing isolation where needed while leaving other areas open to maintain low line loss characteristics.
Solution Approach 2:
The shielding approach transitions from the three-dimensional complete enclosure of strip-line to a two-dimensional planar configuration with ground planes positioned at specific heights above and below the signal line, reducing the shielding volume while maintaining effectiveness.
3Reliability
If coaxial cable is used for RF signal transmission, then signal transmission performance is maintained, but mounting space and cost increase
Solution Approach 1:
The invention creates a planar copy of the coaxial cable's shielding concept using PCB trace technology. Instead of using a physical coaxial cable with cylindrical shielding, the same electromagnetic shielding principle is replicated using planar ground planes and shielding structures on the PCB, achieving similar performance with reduced space and cost.
Solution Approach 2:
The mechanical coaxial cable structure is replaced with an integrated PCB-based micro-strip line configuration. The rigid mechanical assembly of coaxial cable with its outer conductor and insulation is substituted with a flexible PCB layout using copper traces and ground planes, enabling easier integration and reduced mounting space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shielding structure enhances signal transmission efficiency by stabilizing signals and minimizing loss, while maintaining isolation, making it suitable for high-frequency RF signals like 5G.
Implementation Method 1
a conductive member disposed on the first layer so as to have, along the first wire, a separation space that is able to be filled with a dielectric
Implementation Method 2
a separation space that is able to be filled with a dielectric having a second permittivity lower than the first permittivity
Data Source
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AI summary
An electronic device according to various embodiments of the present invention may comprise: a circuit substrate comprising a first layer including a first wire, a second wire formed at one side surface of the first wire along the first wire, and a third wire formed at the other side surface of the first wire along the first wire, a second layer including a ground plane formed along the first wire, the second wire, and the third wire and electrically connected to the second wire and the third wire, and an insulation layer disposed between the first layer and the second layer and having first permittivity; and a conductive member which is disposed above the first layer to have a dielectric-fillable interval space along the first wire and is electrically connected to the ground of the electronic device, the dielectric having second permittivity lower than the first permittivity.