Shielded Microwave Line Interconnect Across Structural Gaps
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Solution Overview
Problem
Existing interconnect structures for microwave transmission lines face challenges in isolating signals from radiating to other parts of the circuit due to mismatched thermal expansion and placement inaccuracies, leading to signal radiation and feedback oscillations, particularly when using wire or ribbon bonds.
Innovation Solution
A structure that uses conductive ink or filament to form a shielded interconnect structure with a 'pillow' or 'pedestal' made of fill-material, providing mechanical stability and separating ground conductors from signal conductors, allowing for additive writing techniques to create printed signal and ground conductors, replacing traditional wire/ribbon bonds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire or ribbon bonds are used to interconnect microwave transmission lines, then electrical connectivity is achieved, but signal radiation and feedback oscillations occur
Solution Approach 1:
A dielectric material is introduced as an intermediary substance between the signal conductor and ground conductor to form a shielded transmission line structure. This dielectric intermediary enables the ground conductor to effectively shield the signal conductor, reducing electromagnetic radiation while maintaining electrical connectivity through the structured interconnection
2Reliability
If structures are mounted with a small gap to prevent thermal stress, then device damage is prevented, but placement accuracy and assembly complexity increase
Solution Approach 1:
The gap between structures is optimized to specific parameter ranges (5-15 mils) that balance thermal stress prevention with placement tolerance. The dielectric material parameters are selected to provide appropriate insulation and mechanical stability within this optimized gap range, allowing automatic assembly techniques to achieve sufficient placement accuracy
3Object-generated harmful factors
If ground signal ground bonds are used to reduce radiation, then electromagnetic radiation is reduced, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The signal interconnection and ground interconnection are merged into a single integrated interconnect structure. The ground conductor is positioned to simultaneously provide electrical grounding and electromagnetic shielding for the signal conductor, eliminating the need for separate ground bonds and reducing overall device complexity while maintaining radiation reduction benefits
Data Source
Figure 1A
Figure 1B~1C
Figure 2A~2B
AI summary
A structure having pair of structure members separated by a gap and an interconnect structure member disposed in the gap. The interconnect structure member includes: a fill-structure having opposing sides in direct contact with the opposing sides of the first structure member and the second structure member; and, an interconnecting microwave transmission line disposed on the fill-structure electrically interconnecting the microwave transmission line of the first structure member to the second member structure. An electrically conductive member is disposed over a signal line of, and electrically connected to the ground conductor the interconnecting microwave transmission.