Shielded Module With Coplanar Electrode and Shield Film
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Solution Overview
Problem
High-frequency modules in electronic devices face challenges in reducing size and signal loss due to the need for wiring electrodes to connect with external antennas, which increases the module's height and mounting area.
Innovation Solution
A module configuration featuring a wiring board with a sealing-resin layer and a resin coating layer that includes a shield film and an outer electrode, where the outer electrode and shield film surfaces are on the same plane or the electrode is closer to the resin layer, allowing direct connection to external antennas without substrate wiring, reducing height and signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a wiring electrode is used to connect the module to an external antenna via the mother substrate, then electrical connection is achieved, but signal loss increases and mounting area is increased
Solution Approach 1:
The invention extracts the outer electrode from the traditional substrate-wiring connection path and integrates it directly into the module structure. The outer electrode is formed on the same plane as the shield film, eliminating the need for wiring electrodes on the mother substrate, thereby reducing signal loss and mounting area requirements
Solution Approach 2:
The invention merges the outer electrode and shield film into a single integrated structure where both are formed on the same plane. This combination eliminates the need for separate wiring electrodes and reduces the overall complexity of the connection structure
2Length of moving object
If the outer electrode and shield film are on different planes, then traditional manufacturing is easier, but module height increases
Solution Approach 1:
The invention transitions from a multi-plane (vertical stacking) arrangement to a single-plane (lateral) arrangement by forming both the outer electrode and shield film on the same plane. This dimensional change reduces module height while the formation process integrates multiple functions into a single manufacturing step
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables reduced module height, improved handleability, and minimized signal loss by eliminating the need for substrate wiring electrodes, while ensuring effective shielding against electromagnetic interference.
Implementation Method 1
a shield film for reducing a probability of the entry of electromagnetic waves from the outside and a probability of the leakage of electromagnetic waves to the outside
Data Source
AI summary
A module 1a includes a multilayer wiring board 2, a component 3 that is mounted on a main surface 2a of the multilayer wiring board 2, a sealing-resin layer 4 that is laminated on the main surface 2a of the multilayer wiring board 2, and a resin coating layer 7 that coats a surface of the sealing-resin layer 4. The resin coating layer 7 includes a shield film 5 and outer electrodes 6, and opposite surfaces 6a of the outer electrodes 6 and an opposite surface 5a of the shield film 5 are formed on the same plane. The module 1a can be connected to, for example, an external antenna without using a wiring electrode of a mother substrate, and thus, signal loss can be suppressed.