Shielded Electronic Component Module With Direct Bump Mounting
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Solution Overview
Problem
Existing electronic component modules experience reliability issues at the bump connecting portion due to the formation of constricted portions when mounted on a mounting board, leading to potential cracks and reduced connectivity.
Innovation Solution
An electronic component module design where the bump components protrude from a sealing resin and are directly connected to a mounting board, eliminating the need for connecting solder and incorporating a substrate with an insulating layer, ground layer, and a ground bump that is exposed and connected to a shield layer, allowing for direct mounting terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connecting solder is used to connect the bump to the mounting board, then the bump is fixed in shape by the sealing resin portion, but a constricted portion is formed in the bump leading to stress concentration and cracks
Solution Approach 1:
The invention removes the connecting solder from the system entirely. The bump component is directly connected to the mounting board without any intermediate solder material, thereby eliminating the constricted portion that forms at the interface between the bump and connecting solder. This extraction of the problematic intermediate element resolves the stress concentration issue.
Solution Approach 2:
Instead of using connecting solder to join the bump to the mounting board (traditional approach), the invention inverts the connection method by having the bump directly contact and connect to the mounting board electrode. This reversal of the connection methodology eliminates the constricted portion formation.
2Weight of moving object
If the bump component is completely embedded in the sealing resin, then the thickness and weight are reduced, but the bump cannot be directly connected to the mounting board
Solution Approach 1:
The sealing resin portion selectively seals different regions of the bump component with different degrees of embedding. The portion of the bump intended for mounting is left exposed and protruding from the sealing resin, while other portions are embedded. This localized differentiation of sealing quality enables both weight reduction through partial embedding and direct connection capability through exposed mounting portions.
3Reliability
If connecting solder is used, then electrical connection is achieved, but strain stress concentrates on the constricted portion during mounting
Solution Approach 1:
The invention extracts and removes the connecting solder from the connection path between the bump and mounting board. By eliminating this intermediate material, the stress concentration point at the constricted portion is removed, and the strain stress is distributed more evenly across the direct bump-to-board interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability of the bump connecting portion by eliminating constricted areas, reduces transmission loss in millimeter waves, and provides electromagnetic shielding, resulting in improved solder bond quality and a compact module structure.
Implementation Method 1
a ground layer, and a ground bump that is electrically connected to the ground layer... the ground layer of the substrate is exposed to a side surface of the substrate, and is electrically connected to the shield layer
Data Source
AI summary
An electronic component module includes a plurality of components including a terminal and placed along a plane, a frame substrate supporting at least some components among the plurality of components, a sealing resin portion sealing the plurality of components and the frame substrate, and a shield layer covering an outer surface of the sealing resin portion. The frame substrate includes an insulating layer, a ground layer, and a ground bump electrically connected to the ground layer, and also an opening supporting a portion other than solder bumps of bump components, and the ground layer of the frame substrate is exposed to a side surface of the frame substrate and is electrically connected to the shield layer. The terminal of the plurality of components and the ground bump are exposed while protruding from a plane of the sealing resin portion and are used as mounting terminals of the electronic component module.