Shielded Module Structure for Stable Lead Electrode Grounding
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Solution Overview
Problem
Existing manufacturing methods for modules result in insufficient and unstable electrical connections between ground electrodes and shield films due to variations in electrode positions and the thinning of shield films, especially when the sealing resin and substrate sides are perpendicular.
Innovation Solution
The module design includes an inclined portion in the substrate where lead electrodes are exposed, allowing for connection to a shield film at a thickened portion, ensuring stable electrical contact despite varying electrode positions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the substrate is cut completely perpendicular to the first surface, then the manufacturing process is simple and efficient, but the shield film becomes thinner toward the lower side resulting in insufficient electrical connection between ground electrodes and shield film
Solution Approach 1:
The side surface of the substrate is designed with an inclined portion instead of being perpendicular, creating an asymmetric structure. This inclination causes the shield film to be thicker at the lower side where ground electrodes are located, ensuring sufficient electrical connection while maintaining manufacturing efficiency
Solution Approach 2:
The inclination angle of the side surface is optimized to balance two requirements: it must be sufficient to prevent shield film thinning at the lower side, but not so steep as to cause excessive material removal or manufacturing difficulty. This parameter optimization resolves the contradiction between manufacturing efficiency and connection reliability
2Reliability
If multiple ground electrodes are arranged at different depths, then the shielding coverage is improved, but it becomes uncertain which part of the module side surface each ground electrode is connected to
Solution Approach 1:
The inclined side surface creates different local regions with varying shield film thicknesses. Ground electrodes at different depths can be strategically positioned to connect with appropriately thickened regions, ensuring reliable electrical connection for each electrode while maintaining clear spatial relationships
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures sufficient and stable electrical connections between ground electrodes and shield films, enhancing shielding performance.
Implementation Method 1
the shield film formed by sputtering tends to become thinner toward the lower side
Data Source
AI summary
A module includes: a substrate including a first surface and including first and second sides; a component as a first component mounted on the first surface; a first sealing resin arranged to cover the first surface and the first component; and a first shield film. An inclined portion is formed in the substrate. The substrate includes a first lead electrode arranged to be exposed to the inclined portion along the first side, and a second lead electrode arranged to be exposed to the inclined portion along the second side, and each of these is connected to the first shield film. A height of the second lead electrode is different from a height of the first lead electrode.