Shielded Module Layout for Reliable Top-to-Side Film Connection
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Solution Overview
Problem
Existing circuit modules face issues with unreliable electrical connections between the top and side surfaces of shield films due to insufficient thickness of the coating resin layer at corner portions, leading to increased manufacturing complexity and reliability concerns.
Innovation Solution
Incorporating a substrate with a first mold resin that covers both the top and side surfaces, featuring first conductor pillars and an upper bypass conductor to establish reliable electrical connections between the top and side surface shield films, thereby ensuring consistent and efficient electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a coating resin layer is formed on the sealing resin layer to cover top and side surfaces, then electrical connection is improved, but the thickness becomes thin at corner portions leading to insufficient reliability
Solution Approach 1:
The invention introduces a step structure that creates a height difference between the top surface and side surface regions. This dimensional change allows the coating resin layer to be applied at different levels, ensuring adequate thickness at corner portions while maintaining proper coverage on both top and side surfaces, thereby solving the thickness uniformity problem.
Solution Approach 2:
The sealing resin layer is divided into distinct regions with different heights through the step structure. The top surface region and side surface region are segmented at different levels, allowing independent optimization of the coating resin layer thickness for each region. This segmentation enables the coating to achieve sufficient thickness at corners without compromising overall electrical connection reliability.
2Reliability
If a step is provided in the sealing resin layer to ensure adequate coating thickness, then electrical connection reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The step structure is formed in the sealing resin layer before the coating resin layer is applied. This preliminary action prepares the surface geometry in advance, allowing the coating resin to be applied uniformly at adequate thickness without requiring complex post-processing or special application techniques, thus improving reliability while controlling manufacturing complexity.
3Manufacturing precision
If special processing is performed to provide a step at the corner portion, then coating thickness is improved, but the number of manufacturing steps increases
Solution Approach 1:
The step structure formation is integrated into the existing sealing resin layer manufacturing process rather than being performed as a separate special processing step. By merging the step formation with the sealing resin application or curing process, the coating thickness precision is improved without significantly increasing the total number of manufacturing steps, thereby maintaining productivity.
Data Source
AI summary
A module includes: a substrate including a first main surface; a first component mounted on the first main surface; a first land electrode provided on the first main surface; a first mold resin that covers at least the first main surface and the first component; a top surface shield film that covers a top surface of the first mold resin; a side surface shield film that covers a side surface of the first mold resin; a first conductor pillar provided in the first mold resin to electrically connect the first land electrode and the top surface shield film; and an upper first bypass conductor provided in the first mold resin to electrically connect the top surface shield film and the side surface shield film.