Shielded Electronic Module Surface Structure to Prevent Film Cracking
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing high frequency module configurations face issues with cracking and peeling of the shield layer due to sharp grinding marks on the semiconductor element, which deteriorate the electromagnetic shielding performance.
Innovation Solution
An electronic component module is designed with a substrate, a semiconductor element mounted on one surface, covered by an insulating resin and a shield film, where the opposite surface of the semiconductor element features an uneven portion with a smoother concave shape to prevent sharp cuts and cracking, and the shield film is directly formed over this surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the sealing resin layer is ground to expose the semiconductor element surface, then the shield layer can be directly formed on the semiconductor element, but grinding marks with sharp shapes are formed causing the shield layer to crack or peel off
Solution Approach 1:
The patent applies local quality by creating an uneven surface structure where concave portions have smoother shapes and convex portions have sharper shapes. This local differentiation allows the shield layer to be formed on a surface that provides both good adhesion (in concave portions) and proper exposure (in convex portions), preventing cracking and peeling while maintaining manufacturing precision.
Solution Approach 2:
The patent uses curvature by designing the uneven surface with concave portions that have smooth, rounded shapes rather than sharp edges. This spherical/curved geometry in the concave portions eliminates stress concentration points that would cause cracking, while the overall uneven structure maintains the necessary exposure of the semiconductor element surface.
2Length of stationary object
If the shield layer is directly formed on the ground semiconductor element surface, then the module height is reduced, but the electromagnetic shielding property deteriorates due to cracking and peeling
Solution Approach 1:
By creating local quality differences in the surface structure (smooth concave portions vs. sharper convex portions), the patent ensures the shield layer adheres properly in critical areas while maintaining the direct formation on semiconductor element, thus preserving both compact height and electromagnetic shielding effectiveness.
Solution Approach 2:
The uneven surface structure with smooth concave portions acts as a beforehand cushioning measure, pre-preventing the formation of cracks and peeling before the shield layer is applied. This proactive surface preparation ensures the shield layer maintains its integrity for electromagnetic shielding without requiring additional height.
Data Source
AI summary
An electronic component module includes a substrate, an electronic component, an insulating resin, and a shield film. The insulating resin covers a first main surface side of the substrate. The insulating resin exposes an opposite surface of the electronic component. The shield film covers the insulating resin and the opposite surface of the electronic component. The opposite surface has an uneven portion. A concave portion of the uneven portion has a smoother shape than a convex portion of the uneven portion.