Shielded Module Structure With Direct Ground Contact
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Solution Overview
Problem
The existing configuration of electronic devices with a conductive film covering a resin film and connected to a grounding conductor through a hole may fail to establish a reliable electrical connection due to the shape of the hole, leading to uncertain conductivity.
Innovation Solution
A module with a two-layer structure comprising a resin film and a conductive film, where the conductive film is securely connected to the substrate's electrode through a conductor structure extending over the resin film, ensuring reliable electrical contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a hole is formed in the resin film to connect the conductive film to the grounding conductor portion, then electrical connection is enabled, but the connection reliability becomes uncertain due to the conical/pyramid/wedge shape of the hole
Solution Approach 1:
The patent removes the intermediate hole structure from the design. Instead of forming a hole through the resin film to connect the conductive film to the grounding conductor, the invention directly bonds the conductive film to the grounding conductor portion, eliminating the unreliable hole interface and achieving direct electrical connection.
Solution Approach 2:
The patent merges the bonding process of the conductive film directly with the grounding conductor portion. By combining these two elements in direct contact without an intermediate hole structure, the invention ensures reliable electrical connection and eliminates the manufacturing precision issues associated with hole formation.
2Area of stationary object
If the conductive film is formed by sputtering to cover the resin film and inside the hole, then complete coverage is achieved, but the conductive film may fail to reach the grounding conductor portion
Solution Approach 1:
The patent eliminates the hole structure that caused the coverage problem. By removing the need to deposit conductive material inside a conical/pyramid/wedge hole, the invention achieves complete and reliable coverage without the risk of the conductive film failing to reach the grounding conductor portion.
Solution Approach 2:
The patent performs the bonding of the conductive film to the grounding conductor portion before or during the sputtering process, ensuring that the conductive film is properly positioned and adhered prior to deposition. This preliminary action prevents the conductive film from failing to reach the grounding conductor.
3Object-affected harmful factors
If a two-layer structure with resin film and conductive film is used to cover the component, then shielding and protection are improved, but the structure complexity increases
Solution Approach 1:
The patent combines the protective and shielding functions into a single integrated structure. The conductive film serves both as a protective layer and as a shielding element against noise interference, eliminating the need for separate shielding structures and reducing overall device complexity.
Solution Approach 2:
The conductive film in the invention performs multiple functions simultaneously: it provides mechanical protection, electrical connection, and electromagnetic shielding. This multi-functionality reduces the need for additional components and simplifies the overall structure while maintaining effective noise suppression.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a reliable electrical connection between the conductive film and the substrate's electrode, enhancing the module's performance by reducing the likelihood of peeling and occupying minimal volume, while also acting as a shield to suppress noise interference.
Implementation Method 1
the conductive film is formed by sputtering to be deposited on a surface of the resin film and inside the hole
Data Source
AI summary
A module includes: a substrate having a first surface; a first component mounted on the first surface; a resin film that covers the first component along a shape of the first component, and also covers a part of the first surface; a conductor film that covers at least a part of the resin film along the shape of the first component, and covers at least a part of a portion in which the resin film covers the part of the first surface; and a conductor structure disposed to extend over a part of the resin film. The conductor structure includes a first end portion, a second end portion, and an intermediate portion. The first end portion and the second end portion are connected to the first surface. The intermediate portion is in contact with the conductor film.