Shielded Module Ground Connection Using Recess and Metal Bump
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Solution Overview
Problem
Existing high frequency modules face challenges in achieving sufficient ground connection due to increased resistance in the ground connection path, particularly when using conductive paste for the shield wall, and difficulties in ground connection with film-shaped shield films.
Innovation Solution
The module incorporates a substrate with a first surface mounting components, a conductive material between the components, a sealing resin covering the components and conductive material, and a shield film covering the sealing resin. A recess in the sealing resin exposes the conductive material, with the shield film extending along the recess's inner surface for electrical connection and a metal bump securing electrical connection to the mother substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conductive paste is used as a material of the shield wall, then the shield wall can be formed to surround components, but a resistance value in a ground connection path increases
Solution Approach 1:
The patent changes the material parameter of the ground connection path from conductive paste to metal bump, which has significantly lower electrical resistance. This parameter change directly addresses the issue of increased resistance while maintaining the shield wall's surrounding function.
Solution Approach 2:
The patent uses a composite structure combining conductive paste (for shield wall formation) and metal bump (for low-resistance ground connection). The conductive paste forms the shield wall structure while the metal bump provides the low-resistance ground path, allowing both functions to coexist without compromising either.
2Object-affected harmful factors
If a film-shaped shield electrode is used to cover the lower surface, then the shield coverage is achieved, but ground connection from a counterpart ground terminal becomes difficult
Solution Approach 1:
The patent segments the ground connection function from the shield coverage function. The film-shaped shield electrode provides continuous shield coverage, while separate metal bumps are positioned at specific locations to provide discrete ground connection points. This segmentation allows both functions to be optimized independently.
Solution Approach 2:
The metal bump acts as an intermediary between the film-shaped shield electrode and the counterpart ground terminal on the mother substrate. It provides a reliable electrical connection interface that overcomes the limitation of direct film-to-terminal connection.
3Device complexity
If the shield film is provided as a film shape, then the shield coverage is simplified, but sufficient ground connection cannot be achieved
Solution Approach 1:
The patent merges two different structural approaches: the simplicity of film-shaped shield coverage and the reliability of bump-based ground connections. The film-shaped shield provides easy-to-manufacture coverage while metal bumps provide reliable ground connection, combining the advantages of both approaches in a single design.
Data Source
AI summary
A module includes a substrate having a first surface, a first component and a second component that are mounted on the first surface, a first conductive material mounted between the first component and the second component, a first sealing resin provided on the first surface to cover the first component, the second component, and the first conductive material, and a first shield film that covers the first sealing resin, in which the first sealing resin has a recess to expose at least a part of the first conductive material, the first shield film extends along an inner surface of the recess and is, thereby, electrically connected to the first conductive material, the first shield film is provided with an opening in the recess, a metal bump is disposed inside the recess, and the metal bump is electrically connected to the first conductive material through the opening.