Shielded Electronic Module Layout for Reduced PCB Footprint
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Solution Overview
Problem
Current electronic module manufacturing techniques, such as PCMA technology, are unable to fully satisfy the need for reduced module size while maintaining functional density and cost-effectiveness.
Innovation Solution
The proposed electronic module design features a printed circuit with offset connection terminals for electrical components, a dielectric coating layer, and a metal protective cage that electrically connects to the reference conductor, allowing for a compact arrangement of components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If PCMA technology is used to manufacture electronic cards with functional zones, then economical manufacturing techniques are achieved even for low production volumes, but the size of electronic modules and the overall electronic board cannot be sufficiently reduced
Solution Approach 1:
The patent transitions from planar arrangement of electrical components to three-dimensional vertical arrangement by offsetting connection terminals in the direction perpendicular to the printed circuit board. This allows components to be stacked vertically rather than arranged horizontally, significantly reducing the footprint area while maintaining electrical connectivity through via structures that extend through the coating layer.
Solution Approach 2:
The patent implements nesting by placing electrical components within the volume defined by the coating layer and protective cage structure. The offset connection terminals allow one component to be positioned above another, with connections made through vertical vias, effectively nesting components in the vertical dimension to reduce overall module volume.
2Area of moving object
If electrical components are arranged with offset connection terminals perpendicular to the printed circuit board, then the surface area is reduced, but additional manufacturing steps and structural complexity are required
Solution Approach 1:
The patent segments the electrical connection path into distinct vertical segments: connection terminals on the printed circuit board, via structures extending through the coating layer, and offset connection terminals on the component. This segmentation allows each element to be optimized independently while maintaining the overall vertical integration that reduces footprint area.
Solution Approach 2:
The patent introduces via structures as intermediary elements that facilitate electrical connection between the printed circuit board and offset connection terminals. These via structures act as mediators that bridge the vertical gap created by offset terminals, enabling compact arrangement without sacrificing electrical connectivity.
Data Source
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AI summary
The present invention relates to an electronic module (10) comprising: - a printed circuit (12) having an upper face (20) and a lower face (22) and comprising a reference conductor, - electrical components (14A, 14B) mounted on the upper face (20) of the printed circuit (12), - a coating layer (16) coating the electrical components (14A, 14B), and - a metal protective cage (18) covering the coating layer (16). The electrical components (14A, 14B) include at least a first electrical component (14A) comprising a first connection terminal (42A) and a second connection terminal (44A), the first connection terminal (42A) and the second connection terminal (44A) being offset from each other in a direction (Z) perpendicular to the upper face (20) of the printed circuit (12), the second connection terminal (44A) being electrically connected to the metal protective cage (18).