Shielded Module With Segmented Plate And Leg Structure
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Solution Overview
Problem
Existing module designs with shield structures face challenges in achieving sufficient shielding performance and mechanical strength, particularly due to insufficient resin sealing and structural weaknesses.
Innovation Solution
A module design featuring a conductive shield member with a plate-like top surface and extending leg portions, where the sealing resin permeates between the shield member and the substrate, providing both effective shielding and mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shield case covers the mounted component, then shielding performance is improved, but mechanical strength becomes insufficient due to inadequate resin sealing
Solution Approach 1:
The shield member is divided into a shield case and a shield bottom plate as separate components. The shield case covers the mounted component while the shield bottom plate remains exposed for resin sealing, enabling both shielding performance and mechanical strength to be achieved through segmented structure design
Solution Approach 2:
Different parts of the shield structure have different functions: the shield case provides electromagnetic shielding coverage over the component, while the shield bottom plate provides a sealing surface for resin application. This local differentiation of function allows the resin to seal at the bottom plate area, ensuring mechanical strength without compromising shielding performance
2Strength
If resin sealing is provided to ensure mechanical strength, then strength is improved, but shielding performance deteriorates when the component is covered with the shield case
Solution Approach 1:
The shield structure is segmented into a shield case for coverage and a shield bottom plate for sealing, allowing resin to be applied at the bottom plate area without interfering with the shielding coverage provided by the shield case
Solution Approach 2:
The shield bottom plate acts as an intermediary element between the mounted component and the resin sealing. It provides a dedicated surface for resin application that does not interfere with the electromagnetic shielding function of the shield case, thus mediating between mechanical sealing requirements and shielding performance
3Object-affected harmful factors
If the mounted component is covered with the shield case, then shielding is improved, but the component cannot be sealed with resin
Solution Approach 1:
The shield member is segmented into a shield case that covers the component and a shield bottom plate that remains accessible for resin sealing. This segmentation allows the manufacturing process to apply resin to the bottom plate area without interference from the component or shield case
Solution Approach 2:
The shield bottom plate is designed in advance as a separate element that provides a predetermined sealing surface. This preliminary design enables the resin sealing process to be performed easily during manufacturing, as the bottom plate already provides the necessary surface geometry and accessibility
Data Source
AI summary
A module includes a substrate including a first surface, at least one first component mounted on the first surface, a shield member mounted on the first surface to cover the first component, and a first sealing resin arranged at least between the shield member and the first surface. The shield member includes a top surface portion in a form of a plate and a plurality of leg portions that extend from the top surface portion toward the first surface.